Senior Mechanical Engineer, Compute and Communications

Anduril Industries; Costa Mesa (CA); On-site; USD 146,000 - 170,000; Full time

Job summary

Anduril Industries is redefining defense technology in the U.S. and allied forces, delivering ruggedized compute and communication hardware that endures harsh environments and battlefield conditions.

You will lead enclosure design and packaging with a multi-disciplinary team, turning concepts into field-ready products that meet strict standards. Join a mission-driven team focused on cutting-edge autonomy, AI, and sensor fusion while collaborating with warfighters to refine products through

Qualifications

• Demonstrated ability to design, prototype, and ship ruggedized electronics hardware.
• Past record of design ownership in a team setting, ideally on enclosures or electromechanical packaging.
• High competence with engineering first principles and problem solving.
• 7+ years of professional mechanical engineering experience.
• Hands-on experience packaging electronics for harsh environments with thermal, shock, vibration, sealing and EMI constraints.
• Familiarity with tolerance stack-up analysis and high-volume manufacturing.
• CAD skills and ability to produce GD&T-driven drawings.
• Experience with high-volume manufacturing methods (machining, sheet metal, molding, die casting, composites).
• Demonstrated hands-on fabrication skills.
• BS/MEng/MS/PhD in engineering; US Person required for export controlled information access.

Responsibilities

• Own ruggedized compute and communications hardware from concept generation to real-world use in the field.
• Serve as a key part of a tight-knit product team spanning electrical, thermal, manufacturing, quality, and industrial design.
• Work with customers to understand real battlefield challenges.
• Design novel enclosures, cooling solutions, and PCBAs for those mission sets — from the ground up.
• Solve the hard packaging problems: thermal management, shock and vibration isolation, environmental sealing (IP/ingress), EMI/EMC shielding, and dense component integration in small form factors.
• Use engineering first-principles, analysis, and testing to ensure your designs survive battlefield conditions and meet MIL-STD-810 and MIL-STD-461.
• Get hands-on to build prototypes and first articles.
• Travel to exercises and work alongside warfighters to support and collect feedback on our products.
• Iterate on your designs and work with our manufacturing team to build and deliver them at scale.

Skills

Ruggedized hardware design

Design ownership

Engineering first principles

7+ years mechanical engineering

Electronic packaging

Thermal management

EMI/EMC constraints

Tolerance analysis

High-volume manufacturing

Fabrication skills

Engineering drawings (GD&T)

BS, M.Eng, MS, or PhD in engineering

US Person for export controls

Education

BS, M.Eng, MS, or PhD in engineering

Tools

NX

Teamcenter

ANALYSIS with ANSYS

Job description

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years.

ABOUT THE TEAM:

Connected Warfare is the team at Anduril dedicated to the modernization of the command and control systems of U.S. and Allied forces. New technologies and new adversaries demand a new approach to battlefield intelligence, and you will be the driving force behind the integration of cutting-edge compute and communications technologies that make that approach a reality. You'll design the ruggedized, small form-factor enclosures that keep advanced electronics alive through shock, vibration, thermal extremes, and the dirt and water of the real battlefield. If you possess a pioneering spirit and a record of excellence in electronics packaging and mechanical design, join us in shaping the future of military might. Your work will not only create new products but also change the balance of defense capabilities on a global scale.

WHAT YOU'LL DO

• Own ruggedized compute and communications hardware from concept generation to real-world use in the field
• Serve as a key part of a tight-knit product team, spanning electrical, thermal, manufacturing, quality and industrial design
• Work with customers to understand real battlefield challenges
• Design novel enclosures, cooling solutions, and PCBAs for those mission sets — from the ground up
• Solve the hard packaging problems: thermal management, shock and vibration isolation, environmental sealing (IP/ingress), EMI/EMC shielding, and dense component integration in small form factors
• Use engineering first-principles, analysis, and testing to ensure your designs survive battlefield conditions and meet standards such as MIL-STD-810 and MIL-STD-461
• Get hands-on to build prototypes and first articles
• Travel to exercises and work alongside warfighters to support and collect feedback on our products
• Iterate on your designs and work with our manufacturing team to build and deliver them at scale

REQUIRED QUALIFICATIONS

• Demonstrated ability to design, prototype, and ship ruggedized electronics hardware
• Past record of design ownership in a team setting (professional or otherwise), ideally on enclosures or electromechanical packaging
• High competence with, and fluid use of, engineering first principles
• 7+ years of professional mechanical engineering experience
• Hands-on experience packaging electronics for harsh environments — managing thermal, shock, vibration, sealing, and EMI constraints
• Familiarity with tolerance stack-up analysis and design for high-volume manufacturing
• CAD skills (any platform) and the ability to produce high-quality, GD&T-driven engineering drawings
• Experience with high volume manufacturing methods: machining, sheet metal, injection molding, die casting, composites, etc.
• Demonstrated hands-on fabrication skills
• BS, M.Eng, MS, or PhD in an engineering field
• Must be a U.S. Person due to required access to U.S. export controlled information or facilities

PREFERRED QUALIFICATIONS

• Experience in NX/Teamcenter
• Experience designing to and testing against MIL-STD-810 (environmental) and MIL-STD-461 (EMI/EMC)
• Knowledge of static, dynamic, thermal, or structural analysis methods in ANSYS
• Active Secret security clearance or the ability to obtain and maintain one

US Salary Range

$146,000 — $170,000 USD

The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top-tier benefits for full-time employees, including:

Benefits

At Anduril, we invest in our people. Our comprehensive, competitive benefits package (available at little to no cost to employees) ensures you’re supported in health, recovery, and whatever comes next. For more information, Explore Our Benefits.