RF Package Design Engineer, Senior Staff

QUALCOMM, Inc.; San Diego (CA); On-site; USD 192,000 - 288,000; Full time

Benefits offered by this job

Bonus program

RSU grants

Benefits package

Job summary

Qualcomm Technologies, Inc. is seeking a senior leader to drive RF package design and electrical characterization for 6G-ready products. The role focuses on leading cross-functional teams across RF-IC, PCB, RF-EM, and Process Tech Development to advance packaging roadmaps and capabilities.

The candidate will manage, train, hire and mentor engineers across geographies, while guiding ...

Qualifications

• Master's degree in Science, Engineering, or related field

Responsibilities

• Work with Package designer & RF-IC block owners to discuss bump/ball assignments and trade-offs
• Establish methods to extract 3D parasitic models for RF packages
• Guide team to troubleshoot RF problems in testbenches
• Define RF simulation methodologies for various package types and IPs
• Collaborate with Advanced Technology team to develop robust RF packaging
• Update design and analysis flow and automate processes
• Create technical documentation and presentations
• Recruit and mentor engineers

Skills

RF packaging design

Electromagnetics

Transmission line theory

Crosstalk

Field solvers

Education

Bachelor's in Electrical/Mechanical/Chemical Eng

Master's in Electrical/Engineering

PhD in Engineering

Tools

ANSYS HFSS

Q3D

PSI

ADS

HSPICE

Cadence Allegro/APD/Sip

Mentor Xpedition

Job description

Company: Qualcomm Technologies, Inc.

Job Area: Engineering Group, Engineering Group > Packaging Engineering

General Summary:

This position is a senior leadership position responsible for leading the RF Package Design. The main role of this position is to focus on Electrical Characterization of RF Packages working with RF design leads. The RF-IC Package and system in package are for products to be used in 6G Infrastructure and 6G consumer devices including mobile phones.

This position requires defining the packaging roadmap and project the resource needs and/or gaps to execute the roadmap. This position will oversee both design and advancing RF packaging roadmaps and develop/extend the company’s technical capabilities. A successful candidate will have a thorough understanding of RF package design and a good understanding of RF circuit design. In addition, the individual should have the ability to formulate plans based on ambiguous project definitions to move the projects forward. As part of a cross-functional development team, the candidate will interact with other essential disciplines, including RF-IC, PCB, RF-EM, System and Process Technology Development teams.

In addition to the technical role, the candidate is expected to manage, train, hire and mentor junior engineers. Principal engineers are expected to work across multiple geographies.

Responsibilities:

• Working with Package designer & various RF-IC block owners (Tx, Rx, LO, PLL, ADC/DAC, etc.) to discuss bump/ball assignments, perform early analysis and discuss trade-offs to optimize the design.
• Establish BKM how to extract 3D parasitic models for various RF packages in ANSYS Electronic Desk Suite (HFSS/3D Layout/Q3D/SIWave).
• Guide team how to troubleshoot various RF problems (DC convergence, leakage, and isolation) efficiently in testbench
• Further define methodologies for RF simulations for various Package type, frequency band and IP requirements.
• Work with Advanced Technology team to develop more robust future RF PKG technology
• Update the design & analysis flow and automate the process
• Create technical documentation and presentations
• Recruit and lead team of engineers. Provide technical mentoring to junior team members

Minimum Qualifications:

• Master's degree in Science, Engineering, or related field
• 10+ years of RF Package/PCB design experience
• Solid understanding and experience in Electromagnetics, Transmission line theory & Crosstalk
• Proficiency in field solvers such as Ansys HFSS, Q3D and PSI
• Proficiency in simulation tools such as ADS and Hspice
• Good knowledge in design tool such as Cadence Allegro/APD/Sip or Mentor Xpedition

Preferred Qualifications:

• Ability to optimize RF design & analysis flow and being able to automate it
• Thorough understanding of Packaging technologies and industry landscape in RF Packaging
• Familiarity with Analog & RF-IC design
• Proficiency in MatLab
• Experience in programming language(c/c++) or scripting language (Perl/Python) is a plus
• People Management experience is a plus
• Ph.D. with 10+ years of experience or Master’s Degree with 15+ years of experiences

Minimum Qualifications:

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
• PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

Pay range and Other Compensation & Benefits:

$191,800.00 - $287,800.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.

• competitive annual discretionary bonus program
• opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus)
• highly competitive benefits package is designed to support your success at work, at home, and at play