Senior Probe Card Design Lead

Micron Technology; Boise (ID); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical benefits

Dental & Vision

Paid time off

Paid holidays

Job summary

Micron Technology in Boise, Idaho, seeks a Senior/Staff Probe Card Engineer to design and qualify probe cards that support Micron's memory and storage products. You will lead design specifications, bond pad layouts, and collaborate with global probe locations.

The role requires 10+ years in probe card design with strong analog/SI/PI knowledge and hands‑on validation using wafer test cells. You will work with cross‑functional teams and report to Test Solutions Engineering.

Qualifications

• 10+ years of hands-on probe card design experience.
• Strong grasp of analog circuits, SI/PI, and mechanical thermal properties (CTE matching).
• Proficient in reading schematics/mechanical specs and validation with wafer test cells.
• Mastery of 3D CAD software, statistics, data analysis, and DOE.
• Self-initiated with ability to manage multiple designs and communicate with leadership.

Responsibilities

• Own probe card design specifications, rules, and bond pad layouts to drive a zero‑defect culture and enable device roadmap requirements.
• Qualify FOAK technologies and define new equipment specifications to ensure manufacturing data meets performance targets.
• Debug pre‑production issues and resolve tactical roadblocks through root‑cause analysis and data review.
• Manage the global supplier base and lead cross‑site meetings to align on technical requirements.
• Partner with internal peer groups and present technical insights to leadership to drive cross‑functional alignment.

Skills

Analog circuits

SI/PI

Data analysis

DOE

Root cause analysis

Education

BS/AS degree

Tools

3D CAD

Probers/Testers

Job description

Micron Technology in Boise, Idaho, seeks a Senior/Staff Probe Card Engineer to design and qualify probe cards that support Micron's memory and storage products. You will lead design specifications, bond pad layouts, and collaborate with global probe locations.

The role requires 10+ years in probe card design with strong analog/SI/PI knowledge and hands‑on validation using wafer test cells. You will work with cross‑functional teams and report to Test Solutions Engineering.