Thermal Mechanical Modeling Engineer

University of Texas; Austin (TX); On-site; USD 120,000 - 190,000; Full time

Benefits offered by this job

Competitive health benefits

Generous paid vacation

Tuition assistance

Robust training access

Employee discount programs

Job summary

A prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. The ideal candidate will have an advanced degree and extensive experience with EDA tools. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows. The position offers competitive benefits, paid time off, and opportunities for professional growth and training.

Qualifications

• 3+ years of hands-on experience in multiphysics simulations for advanced packaging.
• Strong expertise in EDA tools and simulation workflows.
• Experience with high-speed interconnect modeling.

Responsibilities

• Manage semiconductor packaging simulations for advanced integration.
• Collaborate with EDA vendors to refine simulation flows.
• Mentor junior engineers and guide technical strategies.
• Generate user guides, scripts, and automation for repeatable SI/PI co-design.
• Stay current with PCIe Gen6/7, UCIe and related interface standards.
• Mentor junior engineers and represent TI working groups and reviews.

Skills

Multiphysics simulations

EDA/EM tools

Scripting/automation skills

Interconnect modeling

Co-simulation

Thermal analysis

PDK/ADK modeling

IEEE JEDEC UCIe familiarity

Education

MS or PhD in Electrical Engineering, Applied Physics

Tools

Ansys HFSS

Cadence Sigrity

Synopsys RaptorX

COMSOL

CST Studio

Job description

* Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)* Voluntary Vision, Dental, Life, and Disability insurance options* Generous paid vacation, sick time, and holidays* Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds* Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)* Flexible spending account options for medical and childcare expenses* Robust free training access through LinkedIn Learning plus professional conference opportunities* Tuition assistance* Expansive employee discount program including athletic tickets* Free access to UT Austin's libraries and museums with staff ID card* Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card* For more details, please see and and* Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.* Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.* Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.* Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains.* Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.* Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.* Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.* Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.* Other related functions as assigned.* BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.* 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.* Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.* Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.* Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.* You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.* Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.* Location. Austin, Texas is required for close collaboration with our engineering teams and partners.* MS or PhD in Electrical Engineering, Applied Physics, or related discipline.* 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.* Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).* Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.* Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.* Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.* Demonstrated experience creating and validating PDK/ADK simulation collateral spanning thermal, and mechanical domains.* Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.**Start Here, Change the World**At The University of Texas at Austin, tradition meets innovation in the heart of a city that frequents lists of the best places to live and work. Named by Forbes as one of America's Best Large Employers for the sixth year in a row in 2025, UT offers both a dynamic work environment and a gateway to vibrant local culture. Whether you're at the forefront of the student experience, conducting world-changing research or supporting the engine that drives Texas’ flagship university, working at UT means making a lasting impact on our city, our state and our world.Our more than 20,000 faculty and staff empower 55,000+ students to challenge ideas, pursue passions and shape their futures. Joining UT, you’ll become part of a community dedicated to making a meaningful impact on campus and throughout the world.Please see our .**Comments and Inquiries:**Email comments to [e-mail]. For questions or concerns regarding equal opportunity only, contact .Additional information for applicants can be found on the Human Resources web page: . For more job information, call the Human Resource Service Center at [phone], or toll-free at [phone].