Lead Power Architect for High-Density 3D Systems

Acceler8 Talent; Boston (MA); On-site; USD 140,000 - 210,000; Full time

Job summary

Acceler8 Talent is seeking a Lead Power Systems Engineer to own power-delivery architecture for high-density heterogeneous systems. This is a hands-on technical ownership role spanning architecture decisions, physical implementation and measured hardware performance.

You will define power conversion and distribution approaches across electrical, thermal, packaging and system requirements, and work with circuit, RF, packaging and systems engineers to resolve integration challenges, owning

Qualifications

• Led power-delivery architecture for complex hardware with clear ownership.
• Strong understanding of power conversion and distribution in integrated systems.
• Able to validate trade-offs with calculations, modelling and measurements.
• Experience bringing up hardware and debugging in fast-moving projects.
• Experience across electrical, thermal and mechanical/packaging boundaries.
• Able to navigate ambiguity while remaining hands-on.

Responsibilities

• Lead power-delivery architecture from options to hardware.
• Define power conversion and distribution aligned with system requirements.
• Quantify trade-offs in efficiency, density, transient, temperature, reliability.
• Collaborate with circuit, RF, packaging, and systems teams to resolve integration issues.
• Own hardware bring-up, measurement, and debug; refine designs from results.
• Help set engineering methods and priorities in a founding-team.

Skills

Power delivery

Power systems

Trade-off analysis

Hardware bring-up

Thermal & packaging

Ambiguity handling

Cross-disciplinary

Job description

Acceler8 Talent is seeking a Lead Power Systems Engineer to own power-delivery architecture for high-density heterogeneous systems. This is a hands-on technical ownership role spanning architecture decisions, physical implementation and measured hardware performance.

You will define power conversion and distribution approaches across electrical, thermal, packaging and system requirements, and work with circuit, RF, packaging and systems engineers to resolve integration challenges, owning