Senior Platform Software Engineer: BSP & Fabric

Blue Origin LLC; Denver (CO); On-site; USD 182,000 - 254,000; Full time

Job summary

Blue Origin LLC in Colorado is seeking a highly skilled platform software engineer to own the Board Support Package (BSP) and fabric bring-up for our accelerator compute payloads. You will manage the lowest software layers, from bootloader to kernel, drivers, and HAL, ensuring reliable space-grade operation.

The role emphasizes hands-on debugging of hardware, integration with high-speed interconnects, and robust resilience against radiation-induced errors, contributing to a cutting-edge compute

Qualifications

• Bachelor's degree in CS/CE or related field.
• 6+ years of embedded Linux BSP or low-level platform software development.
• Direct, hands-on experience with accelerator hardware bring-up.
• High proficiency in C/C++ and Python for embedded systems.
• Familiarity with GPU programming models (CUDA/ROCm) and NCCL/RCCL.
• Proven ability to debug hardware at driver/firmware level in low-observability environments.

Responsibilities

• Develop and own BSP for accelerator compute modules (bootloader, kernel bring-up, drivers, HAL).
• Lead software bring-up and validation of high-speed compute fabric.
• Implement and manage in-flight health monitoring (temps, ECC, power, interconnect).
• Design automatic recovery for radiation-induced soft errors to ensure resilience.
• Define API boundaries between platform software and higher-level services (inference runtime, orchestration).

Skills

Embedded Linux BSP

C/C++

Python

GPU programming

Education

Bachelor's degree in CS/CE

Tools

CUDA

ROCm

NCCL

RCCL

Job description

Blue Origin LLC in Colorado is seeking a highly skilled platform software engineer to own the Board Support Package (BSP) and fabric bring-up for our accelerator compute payloads. You will manage the lowest software layers, from bootloader to kernel, drivers, and HAL, ensuring reliable space-grade operation.

The role emphasizes hands-on debugging of hardware, integration with high-speed interconnects, and robust resilience against radiation-induced errors, contributing to a cutting-edge compute