Senior Photonics Engineer – PIC Design & Tapeout Lead

Acceler8 Talent

Washington (District of Columbia)

On-site

USD 120,000 - 180,000

Full time

14 days+

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Job summary

Acceler8Talent is partnering with a Washington, DC area photonics startup to hire a Senior/Staff Integrated Photonics Engineer. You will design next-generation photonic integrated circuits, tape out devices, and characterize them end-to-end, collaborating with foundries and packaging vendors to move from prototype to deployment.

The role demands hands-on device testing, data analysis, and the ability to drive design iterations in a fast-paced engineering environment.

Qualifications

  • MS or PhD in Electrical Engineering, Physics, Photonics, Optics, or related STEM field.
  • 3–10 years experience in designing and developing photonic integrated circuits.
  • Experience owning PIC designs through layout, tapeout, fabrication, and characterization.

Responsibilities

  • Design, simulate, layout, and tape out photonic integrated circuits and subsystems.
  • Develop and optimize active and passive photonic devices for next-generation optical systems.
  • Perform hands-on characterization and testing of fabricated photonic devices and circuits.
  • Analyze measurement data and drive future design iterations.
  • Collaborate with foundry partners and cross-functional teams to deliver hardware.
  • Develop scalable workflows for PIC design, simulation, characterization, and automation.
  • Lead technical efforts and contribute to product development roadmaps.

Skills

PIC design
Device testing
Data analysis
Lumerical
Python
MATLAB
Photonic simulation

Education

MS/PhD in EE/Physics/Photonics

Tools

Lumerical
FDTD
MODE
Cadence Virtuoso
KLayout
GDSFactory
Python
MATLAB

Job description

Acceler8Talent is partnering with a Washington, DC area photonics startup to hire a Senior/Staff Integrated Photonics Engineer. You will design next-generation photonic integrated circuits, tape out devices, and characterize them end-to-end, collaborating with foundries and packaging vendors to move from prototype to deployment.

The role demands hands-on device testing, data analysis, and the ability to drive design iterations in a fast-paced engineering environment.

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