Senior Photonic IC Design Engineer (Tapeout & Packaging)

Beacon Photonics; Arlington (VA); On-site; USD 130,000 - 230,000; Full time

Benefits offered by this job

Employee stock ownership

401(k) matching

Paid time off

Parental leave

Holidays

Health, dental, and vision coverage

Job summary

Beacon Photonics seeks an Integrated Photonics Engineer to design, layout, and characterize heterogeneous photonic integrated circuits for next‑gen laser components and systems. You will collaborate with cross‑functional teams and external foundries to deliver prototypes and scalable processes, reporting to senior leadership.

You will tackle tape‑out, simulations, data analysis, packaging, and advanced laser measurements, contributing to breakthroughs in optical microsystems. A Ph.D.

Qualifications

• Ph.D. in physics, electrical engineering, or MS with 3+ years in integrated photonics.
• Experience simulating photonic components with physics-based models.
• Tape out and layout experience in foundries (Python, gdsfactory, Cadence).
• Hands-on characterization of photonic and electronic devices.
• Familiarity with semiconductor fabrication processes.

Responsibilities

• Design, develop, and tape out cutting-edge photonic integrated circuits and systems.
• Simulate optical components and devices to predict and optimize performance.
• Analyze data, generate test reports, and synthesize results to inform design iterations.
• Develop and refine heterogeneous integration processes with external foundry partners.
• Create scalable simulation, layout, and characterization workflows.
• Direct external vendors for prototype packaging and fabrication.

Skills

Photonic integration

Optical simulation

Experimental data analysis

Cross-functional collaboration

Education

Ph.D. in physics or EE

M.S. with 3+ years in photonics

Tools

FDTD

EME

VPI

Simulink

Python

gdsfactory

Cadence

Job description

Beacon Photonics seeks an Integrated Photonics Engineer to design, layout, and characterize heterogeneous photonic integrated circuits for next‑gen laser components and systems. You will collaborate with cross‑functional teams and external foundries to deliver prototypes and scalable processes, reporting to senior leadership.

You will tackle tape‑out, simulations, data analysis, packaging, and advanced laser measurements, contributing to breakthroughs in optical microsystems. A Ph.D.