Senior Photonics Engineer: Laser-III-V Integration
Coherent
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Job summary
Coherent in Fremont, CA seeks a Senior Photonics Engineer to lead development of next‑generation integrated laser technologies for advanced optical communications. You will drive laser integration solutions for compact transceivers and co-packaged optics, and design photonic components like waveguides, resonators, and Bragg gratings.
The role requires deep expertise in III‑V materials, silicon photonics, and packaging, plus collaboration with epitaxy and fabrication teams to optimize device
Qualifications
- PhD or Master in Electrical Engineering, Photonics, Optics, or related field.
- 5+ years of industry or advanced research in semiconductor lasers or integrated photonics.
- Strong knowledge of semiconductor laser physics and laser device operation.
- Experience with III-V and silicon photonics integration is highly desirable.
Responsibilities
- Lead development of next-generation integrated laser technologies for optical communication and photonic systems.
- Develop innovative laser integration solutions for highly integrated optical transceivers and co-packaged optics.
- Design and optimize photonic components and circuits supporting laser integration (waveguides, couplers, Bragg gratings, resonators, filters).
- Collaborate with III-V device and epitaxy teams to define laser and gain-chip requirements and optimize performance.
- Design photonic interfaces between laser chips and PICs, including mode converters and optical coupling structures.
- Work with fabrication teams and foundries to define device structures and fabrication processes.
Skills
Education
Tools
Job description
Coherent in Fremont, CA seeks a Senior Photonics Engineer to lead development of next‑generation integrated laser technologies for advanced optical communications. You will drive laser integration solutions for compact transceivers and co-packaged optics, and design photonic components like waveguides, resonators, and Bragg gratings.
The role requires deep expertise in III‑V materials, silicon photonics, and packaging, plus collaboration with epitaxy and fabrication teams to optimize device
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