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Intel Corporation's Design Technology Platform seeks engineers to advance density fill and PDK solutions across leading nodes. This role sits at the intersection of process technology, physical verification, and design automation.
You will partner with EDA vendors and internal teams to deliver scalable tools, validation suites, and robust methodologies that improve manufacturability and design productivity.
Job Details: Job Description: Shape the Future of Advanced Semiconductor Technology at Intel Join Intel's Design Technology Platform (DTP) organization and become part of a world-class team enabling the next generation of semiconductor innovation. In this highly visible role, you will develop and deploy advanced density fill methodologies and Process Design Kit (PDK) solutions that directly impact Intel's most advanced technology nodes and product designs. Working at the intersection of process technology, physical verification, and design automation, you will collaborate with leading engineers across Intel and the EDA ecosystem to solve complex manufacturability challenges, improve design productivity, and enable breakthrough technologies. Your contributions will influence how future products are designed and manufactured, helping Intel maintain technology leadership in an increasingly competitive industry.
We are particularly interested in candidates who have developed physical verification methodologies, density-fill solutions, or PDK technologies within: Semiconductor Foundries. Integrated Device Manufacturers (IDMs). Advanced Packaging and OSAT Organizations. EDA Software Companies. Design Enablement or CAD Teams supporting advanced-node development.
Qualifications:
This role offers a rare opportunity to work on technology challenges that influence the future of semiconductor manufacturing. You'll collaborate with experts across process technology, CAD, physical design, and EDA while helping define methodologies used across Intel's most advanced products. If you are passionate about solving complex physical verification and manufacturability problems at scale, this role offers both significant technical depth and broad organizational impact. Join Intel and make a direct impact on the next generation of semiconductor innovation.
Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix, US, California, Santa Clara, US, Texas, Austin
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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Annual Salary Range for jobs which could be performed in the US: $149,600.00-284,580.00 USD
Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
* Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.