Senior Packaging Reliability Engineer — AI Hardware & Equity

OpenAI

San Francisco (CA)

On-site

USD 266,000 - 445,000

Full time

9 days ago

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Job summary

OpenAI is seeking an Advanced Packaging Reliability Engineer in San Francisco to lead reliability for AI-grade packages. You will model thermo-mechanical behavior, assess failure mechanisms, and guide design and materials choices to improve lifetime and scalability of HPC systems.

You will partner with design, silicon, and manufacturing teams to predict performance, develop qualification strategies, and drive robust, production-ready packaging solutions for OpenAI’s supercomputing platform.

Qualifications

8+ years in semiconductor package reliability; electromigration, solder-joint fatigue, interfacial delamination, die/through-silicon issues.
Experience with 2.5D/3.5D integration, interposers, large substrates, HBM integration.
Leadership in package failure investigations and corrective actions.
Strong thermo-mechanical finite-element modeling of packages and reliability.
Understanding of material properties, CTE, elasticity, viscoelasticity, creep, and fracture toughness.

Responsibilities

Lead reliability test plans for advanced HPC packages; risk analysis and root-cause investigations.
Drive design optimization using thermo-mechanical modeling to improve reliability, power integrity, and cooling.
Develop and apply reliability models and lifetime predictions for assembly and operating conditions.
Evaluate architectures, materials, and processes to maximize reliability and manufacturing robustness.
Predict electromigration lifetime under product-specific conditions.