Packaging Reliability Engineer - AI HPC, Equity

OpenAI; San Francisco (CA); On-site; USD 266,000 - 445,000; Full time

Job summary

OpenAI is seeking an Advanced Packaging Reliability Engineer based in San Francisco to lead reliability engineering for advanced AI packages. In this role, you will assess and optimize package reliability, working closely with multi-functional teams to predict package behavior and improve overall robustness, while developing innovative testing methodologies.

Ideal candidates will have significant experience in semiconductor package reliability, thermal modeling, and demonstrate strong problem-solving skills. Competitive compensation ranges from $266K to $445K plus equity offerings.

Qualifications

• 8+ years of experience in semiconductor package reliability principles.
• Strong experience with finite-element modeling of packages.
• Familiarity with package failure-analysis techniques.

Responsibilities

• Lead reliability test plan and assessments for advanced HPC packages.
• Drive reliability-focused package design optimization.
• Develop, validate, and apply package reliability models.

Skills

Semiconductor package reliability principles

Thermal and mechanical modeling

Root-cause analysis

Education

MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or related field

Job description

OpenAI is seeking an Advanced Packaging Reliability Engineer based in San Francisco to lead reliability engineering for advanced AI packages. In this role, you will assess and optimize package reliability, working closely with multi-functional teams to predict package behavior and improve overall robustness, while developing innovative testing methodologies.

Ideal candidates will have significant experience in semiconductor package reliability, thermal modeling, and demonstrate strong problem-solving skills. Competitive compensation ranges from $266K to $445K plus equity offerings.