Senior Package Reliability Engineer - 2.5D/3D FEM & Thermal

191 Altera Corporation; San Jose (CA); On-site; USD 166,900 - 240,000; Full time

Job summary

Altera Corporation in San Jose, California, is seeking an experienced Package Reliability Engineer to characterize and qualify advanced 2.5D/3D semiconductor packages. You will partner with development and manufacturing teams on materials selection and reliability targets, and lead thermomechanical analyses.

The role requires a Master’s degree and 8+ years in package reliability, proficiency with FEM tools (Ansys/Abaqus/COMSOL), and experience with JEDEC/MIL-STD/IPC/AEC standards.

Qualifications

• Master’s degree in Mechanical Engineering, Materials Science, Packaging Engineering, or related field.
• 8+ years of experience with thermal and thermomechanical analysis for semiconductor packages.
• 3+ years of experience with 2.5D/3D and heterogeneous integration packaging.

Responsibilities

• Partner with package development and assembly teams for materials selection to meet reliability requirements.
• Develop and maintain FEM models using Ansys/Abaqus to analyze warpage and thermomechanical behavior.
• Define and execute data collection strategies for coplanarity, warpage, and reliability.

Skills

Thermal and thermomechanical analysis

Finite element modeling (Ansys/Abaqus)

2.5D/3D packaging experience

Python automation

Reliability statistics and lifetime"

Education

Master’s degree in Mechanical Engineering, Materials Science, Packaging Engineering

Tools

Ansys

Abaqus

COMSOL

Job description

Altera Corporation in San Jose, California, is seeking an experienced Package Reliability Engineer to characterize and qualify advanced 2.5D/3D semiconductor packages. You will partner with development and manufacturing teams on materials selection and reliability targets, and lead thermomechanical analyses.

The role requires a Master’s degree and 8+ years in package reliability, proficiency with FEM tools (Ansys/Abaqus/COMSOL), and experience with JEDEC/MIL-STD/IPC/AEC standards.