Senior Package Reliability Engineer

Altera; San Jose (CA); On-site; USD 166,900 - 240,000; Full time

Job summary

Altera is seeking an experienced Package Reliability Engineer in San Jose, CA to characterize and qualify advanced 2.5D/3D semiconductor packages. You will partner with development and manufacturing teams to ensure thermomechanical reliability and drive lifetime predictions using FEM tools.

You will lead DFMEA/FMEA activities, develop customer reports, and ensure compliance with JEDEC/MIL-STD/IPC/AEC standards, working on FPGA-related packaging challenges.

Qualifications

• Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or related field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis.
• 8+ years using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.
• 8+ years developing, analyzing, and validating advanced packaging technologies, including 2.5D, 3D, and heterogeneous integration, with strong package reliability knowledge.
• 3+ years applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments.
• 3+ years developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.

Responsibilities

• Partner with package development and assembly teams for packaging materials selection to meet product thermomechanical reliability requirements
• Develop and maintain advanced semiconductor package thermal and thermomechanical finite element models using commercial software (e.g., Ansys, Abaqus)
• Define, execute and interpret package coplanarity, warpage, and second level reliability data collection strategies to calibrate the FEM models
• Lead package reliability evaluations to validate package robustness as defined by industry standards such as JEDEC, MIL-STD, IPC, and AEC using test‑chips and products
• Understand FPGA use conditions and develop customer reports, communications related to package thermal and thermomechanical concerns.
• Perform reliability lifetime prediction modeling from stress test/field data
• Develop and own package DFMEA/FMEA’s partnering with development and manufacturing teams

Skills

Thermal analysis

Thermomechanical analysis

Warpage analysis

Coplanarity analysis

Reliability modeling

Education

Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or related technical field

Tools

Ansys

Abaqus

COMSOL

Python

Job description

About Altera

At Altera™, our independence as the world's largest pure‑play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry‑leading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets like AI, cloud, networking, and edge. As an independent company, we move faster, invest deeper, and partner more closely‑empowering our teams to drive breakthrough innovation and shape the future of the FPGA industry.

About the Role

We are seeking an experienced semiconductor Package Reliability Engineer responsible for characterizing and qualifying advanced 2.5D/3D semiconductor packages. This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical characterization for advanced packaging technologies.

Key Responsibilities

• Partner with package development and assembly teams for packaging materials (substrate, and assembly materials) selection to meet product thermomechanical reliability requirements
• Develop and maintain advanced semiconductor package thermal and thermomechanical finite element models using commercial software (e.g., Ansys, Abaqus)
• Define, execute and interpret package coplanarity, warpage, and second level reliability data collection strategies to calibrate the thermal and thermomechanical FEM models
• Lead package reliability evaluations to validate package robustness as defined by industry standards such as JEDEC, MIL-STD, IPC, and AEC using test‑chips and products
• Understand FPGA use conditions and develop customer reports, communications related to package thermal and thermomechanical concerns.
• Perform reliability lifetime prediction modeling from stress test/field data
• Develop and own package DFMEA/FMEA’s partnering with development and manufacturing teams

Salary Range

The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job‑related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.
$166,900 - $240,000 USD

Minimum Qualifications

• Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis
• 8+ years of experience using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent) to develop and analyze warpage, coplanarity, stress, and deformation models for advanced semiconductor packages.
• 8+ years of experience developing, analyzing, and validating advanced semiconductor packaging technologies, including 2.5D, 3D, and heterogeneous integration packages, with a strong understanding of package reliability.
• 3+ years of experience applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments.
• 3+ years of experience developing scripts or software using Python for automation, simulation workflows, data analysis, and post‑processing.

Preferred Qualifications

• Deep understanding of thermal, mechanical and thermomechanical characteristics of advanced 2.5D/3D flip‑chip packages
• Ability to correlate between thermomechanical simulations and package dynamic warpage and package behavior in surface mount system level assembly
• Develop customer facing collaterals for packaging risk assessments

Job Type

Regular

Shift

Shift 1 (United States of America)

Primary Location

San Jose, California, United States

Additional Locations

—

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.