Senior Package & PCB Layout Engineer - 2.5D/3D IC Expert

Sierra Wireless; Falls Church (VA); On-site; USD 74,000 - 86,000; Full time

Job summary

Semtech Corporation’s R&D hardware design team is seeking a Package and PCB Layout Engineer in Falls Church, VA. You will contribute to high‑speed designs across interconnect technologies and partner with manufacturing, thermo‑mechanical, and other engineering groups.

You will apply advanced EDA tools to create multi‑layer substrates, carrier layouts, and wafer-level interconnects, while coordinating with global suppliers and internal teams to meet schedule and design rules.

Qualifications

• Bachelor’s degree in engineering, physics, or another discipline relevant to the position.
• 5 years of layout experience in high-speed package and/or advanced PCB technologies.
• Solid knowledge of high-speed layout and electronic design.
• Advanced knowledge of EDA layout tools.

Responsibilities

• Perform package design feasibility assessments with manufacturing and thermo-mechanical teams.
• Develop multi-layer substrate and carrier layouts for 2D/2.5D/3D IC configurations.
• Develop wafer-level interconnect layouts using redistribution layers and wafer reconstruction technologies.

Skills

High-speed layout

Electronic design

Cross-functional teamwork

Independent work

Communication

Education

Bachelor’s degree in engineering, physics, or related

Tools

Cadence APD

Allegro

Job description

Semtech Corporation’s R&D hardware design team is seeking a Package and PCB Layout Engineer in Falls Church, VA. You will contribute to high‑speed designs across interconnect technologies and partner with manufacturing, thermo‑mechanical, and other engineering groups.

You will apply advanced EDA tools to create multi‑layer substrates, carrier layouts, and wafer-level interconnects, while coordinating with global suppliers and internal teams to meet schedule and design rules.