Senior Overlay Architect – Advanced DRAM & Bonding

Micron Technology, Inc; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Medical, dental & vision

Paid time off

Paid holidays

Benefits guide

Job summary

Micron Technology, Inc. seeks a Senior Overlay Engineer to drive the roadmap for overlay technologies and bond integration in next‑gen memory devices.

You will lead simulation, experimental development, and metrology programs, collaborating with Process Integration, Lithography, Bonding, and Manufacturing teams to deliver scalable solutions. The role emphasizes technical leadership, supplier engagement, and the translation of complex data into actionable process improvements, with opportunities

Qualifications

• Experience in overlay concepts and yield management.
• Ability to lead cross‑functional teams across engineering disciplines.
• Strong problem solving with data‑driven approach.

Responsibilities

• Own the overlay roadmap and define specifications, budgets, and scaling needs for future nodes.
• Lead simulation and experimental development connecting process behavior to device requirements.
• Drive overlay metrology, automation, and analytics with Process and Metrology teams.
• Provide technical leadership across multiple engineering groups and supplier partners.

Skills

Overlay technology

Process integration

Metrology

Simulation

AI analytics

Mentoring

Tools

Metrology tools

Modeling software

Job description

Micron Technology, Inc. seeks a Senior Overlay Engineer to drive the roadmap for overlay technologies and bond integration in next‑gen memory devices.

You will lead simulation, experimental development, and metrology programs, collaborating with Process Integration, Lithography, Bonding, and Manufacturing teams to deliver scalable solutions. The role emphasizes technical leadership, supplier engagement, and the translation of complex data into actionable process improvements, with opportunities