Senior Optical Process Engineer

Entangled Future; Milpitas (CA); Hybrid; USD 150,000 - 230,000; Full time

Job summary

PsiQuantum in Milpitas, California, seeks a Senior Optical Process Engineer to lead process development and assembly build for R&D and volume deployment in the System Build team. The role spans packaging, processing, and related qualifications, requiring a proactive, collaborative mindset across multiple disciplines.

The candidate will drive design-to-build processes, leverage DFx tools, and partner with supply chain to enable scalable quantum computer subsystems, from cryogenic to room

Qualifications

• Master’s degree or higher in an applicable engineering discipline.
• 5+ years of experience solving opto‑mechanical assembly process problems.
• Experience with photonics sub-assembly and semiconductor packaging/inspection equipment.
• Familiar with opto‑mechanical packaging equipment, suppliers, and quality systems.
• Strong communication, leadership, and problem‑solving skills.

Responsibilities

• Develop assembly process flows and build sub‑assemblies for QC subsystems with electronics and photonics.
• Finalize design and process flow using DFM, DFQ, and FMEA to meet targets.
• Deliver and verify equipment, tooling, and fixtures with supply chain support.
• Release process documents, train operations, and ensure change controls are followed.
• Develop in‑house processes with Operations and manage external manufacturing as needed.

Skills

Optical engineering

Process engineering

Packaging engineering

Applied physics

Mechanical engineering

Education

Master’s degree in Engineering

Tools

DFM

DFQ

FMEA

Process capability analysis

Job description

Senior Optical Process Engineer at PsiQuantum, Milpitas, California. A senior-level full time position in the 4560 - System Build team, listed under hardware engineering.

Come join us.

Job Summary

The Senior Optical Process Engineer will be responsible for process development and assembly build with quality for R&D and volume system integration and deployment at PsiQuantum. This role requires engineering disciplines in packaging, processing, and associated qualifications, a strong “can-do” attitude in a fast-paced environment, problem-solving, and excellent communication with teams across multiple disciplines

Experience/Qualifications

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to [e-mail] .

Responsibilities

• By working with the sub-assembly design and packaging engineering team, develop assembly process flows and build sub-assemblies for quantum computer (QC) subsystems with electronics and silicon photonics chips on PCBAs for both cryogenic and room-temperature vacuum systems.
• By working with a cross-functional team and suppliers, finalize the design and assembly process flow using DFM, DFQ, and FMEA tools to meet design targets and requirements set by the sub-system team.
• Deliver and verify equipment, tooling, and fixtures from suppliers with the support of the supply chain. Complete process development and buy-off, including process capability analysis and a report.
• Release the assembly process document, work instructions, and control plans in the systems with change controls; train, audit, and release the processes and controls to the operations team for volume assembly builds.
• Develop in-house processes with the Operations team and manage contractor manufacturing for external processes, and be responsible for process technical support.

Requirements

• Master’s degree or higher in an applicable engineering discipline, such as Process Engineering, Mechanical Engineering, Optical Engineering, or Applied Physics.
• 5+ years of experience applying engineering principles to solve complex opto-mechanical assembly process problems.
• Exposure to photonics sub-assembly with experience in semiconductor packaging and inspection equipment, processes, and material systems (die attach, wire bonding, optical coupling, flip chip, underfill, etc.).
• Familiar with key opto-mechanical packaging and assembly equipment, piece-part supplier base, and the quality system.
• Experience in design, analysis, and assembly of subsystems; built NPI pilot line, transferred process to operation, and supported manufacturing; supplier and contract manufacturing management experience is a plus
• Excellent written and verbal communication skills; Self-starter.
• Demonstrated strong analytical and problem-solving skills.
• Ability to provide technical leadership in ambiguous situations.

Nice to Have

• Experienced in data processing tools such as Python, MATLAB, and JMP.
• Experience working within opto-mechanical process teams with a proven track record to bring a product to volume (e.g., in semiconductor, datacom, telecom, optical communication industry).
• Familiarity with back-end semiconductor assembly processes, testing methodologies, and equipment, including die attach, wire-bonding, and AOI.
• Demonstrated ability to manage short deadlines and to follow a disciplined work process. Able to work in a fast-paced environment.
• Ability to build relationships with multiple groups with strong communication skills to provide process perspective input during product development.
• A lead by example person, lead from the front attitude when all hands-on-deck situations arise, get involved in day-to-day tasks to assure peak performance and safe work environment for everyone.
• Provide guidance and training to technicians to enable R&D prototype line.
• Good team worker, brings in a positive attitude, and is always ready to help others.