Senior Multi-Layer PCB Designer for High-Density Boards

Microsoft; Redmond (WA); On-site; USD 130,000 - 190,000; Full time

Job summary

Microsoft in Redmond seeks an experienced PCB Design Engineer to own complex PCB layouts from requirements through release, including placement, routing, stack-up, impedance, and DFM. You will collaborate with electrical, mechanical, and manufacturing teams to translate schematics into manufacturable boards and drive robust release packages.

Ideal candidates blend strong multi-layer PCB knowledge with signal integrity, impedance control, and high-density interconnect expertise, and can leverage

Qualifications

• Degree in Electrical Engineering, Computer Engineering, or related field with 5+ years of technical engineering experience, or a Master’s with 3+ years.
• Experience with multi-layer PCB design, impedance control, and high-density interconnects.
• Ability to work with cross-functional teams and suppliers for DFM and release packages.
• U.S. export control eligibility and potential ITAR/EAR considerations.

Responsibilities

• Own PCB layout from requirements to design release.
• Collaborate with electrical, mechanical, and manufacturing disciplines.
• Perform design reviews, DRC closure, stack-up assessment, and documentation.
• Develop manufacturing release packages and support fabrication feedback.
• Improve methodologies, libraries, and automation.

Skills

Multi-layer PCB

Signal integrity

Controlled impedance

High-density interconnect

DFM

Schematic/board layout

Cadence Allegro

Library management

Board bring-up

Cross-disciplinary collaboration

Education

Bachelor’s degree in Electrical/Computer Engineering

Master’s degree in Electrical/Computer Engineering

Tools

Cadence Allegro

ECAD tools

Schematic capture tools

Job description

Microsoft in Redmond seeks an experienced PCB Design Engineer to own complex PCB layouts from requirements through release, including placement, routing, stack-up, impedance, and DFM. You will collaborate with electrical, mechanical, and manufacturing teams to translate schematics into manufacturable boards and drive robust release packages.

Ideal candidates blend strong multi-layer PCB knowledge with signal integrity, impedance control, and high-density interconnect expertise, and can leverage