Senior Microelectronics Packaging Process Engineer

Teledyne Technologies Incorporated; Milpitas (CA); Presencial; USD 91.000 - 121.000; Jornada completa

Descripción de la vacante

Teledyne Technologies Incorporated is seeking a Senior Process Engineer in Milpitas, California to help develop manufacturing processes for high-reliability microelectronic products. You will work with cross-functional teams to take packaging and assembly from concept to production qualification.

The role requires 8+ years in microelectronic assembly, expertise in die attach, wire bonding, flip chip, and materials, plus strong communication. U.S.

Formación

• 8+ years of experience in microelectronic assembly process development.
• Experience with die attach, wire bonding, flip chip, underfill, encapsulation.
• Bachelor's or master's degree in engineering or materials science.

Responsabilidades

• Develop, scale, and maintain microelectronic packaging and assembly processes.
• Establish process controls and evaluate new materials and automated equipment.
• Support MRB activities and resolve nonconforming product issues.
• Collaborate with suppliers and customers on material and production concerns.
• Contribute to design reviews and manufacturability of new products.
• Design tooling, fixtures, BOMs, and assembly drawings.
• Program, troubleshoot, and qualify manufacturing equipment.
• Create clear process documentation and production instructions.
• Apply statistical analysis, process control, and DOE.
• Communicate complex technical topics across audiences.

Conocimientos

Process development

Die attach

Wire bonding

Flip chip

Underfill

Encapsulation

Hermetic sealing

Packaging experience

Statistical analysis

Process control

Communication skills

Educación

Bachelor's or Master's degree in Engineering/Materials Science

Herramientas

Equipment programming

Statistical software

Descripción del empleo

Teledyne Technologies Incorporated is seeking a Senior Process Engineer in Milpitas, California to help develop manufacturing processes for high-reliability microelectronic products. You will work with cross-functional teams to take packaging and assembly from concept to production qualification.

The role requires 8+ years in microelectronic assembly, expertise in die attach, wire bonding, flip chip, and materials, plus strong communication. U.S.