Senior Process Engineer — High‑Reliability Microelectronics Packaging

FLIR Systems, Inc.; Milpitas (CA); Hybrid; USD 91,000 - 121,000; Full time

Job summary

Teledyne e2v HiRel Electronics, part of Teledyne Technologies Incorporated, seeks a Senior Process Engineer to develop and scale microelectronic packaging and assembly processes in Milpitas, CA. You will drive process controls, evaluate new materials, and collaborate across suppliers, customers, and internal teams.

You will lead design reviews, manage qualification activities, and document tooling, BOMs, and production instructions while applying DOE, statistics, and problem-solving to ensure

Qualifications

• Experience in developing microelectronic assembly processes.
• Breadth in die attach and packaging processes.
• Knowledge of materials and equipment qualification.
• Strong written and verbal communication skills.
• 8+ years of relevant experience.

Responsibilities

• Develop, scale, and maintain microelectronic packaging and assembly processes.
• Establish process controls and evaluate new materials and equipment.
• Support material review board activities and resolve nonconforming product issues.
• Collaborate with suppliers and customers on material and production concerns.
• Contribute to design reviews, DFM, and new product development.
• Design and document tooling, fixtures, BOMs, and assembly drawings.
• Program, troubleshoot, and qualify manufacturing equipment.
• Create clear process documentation and production instructions.
• Apply statistics, process control, and DOE methods.
• Communicate complex topics across technical and operational teams.

Skills

Process development

Die attach

Wire bonding

Flip chip

Underfill

Hermetic sealing

Process control

Communication skills

Hands-on equipment programming

Education

Bachelor's or Master’s degree in Engineering, Materials Science, or related field

Job description

Teledyne e2v HiRel Electronics, part of Teledyne Technologies Incorporated, seeks a Senior Process Engineer to develop and scale microelectronic packaging and assembly processes in Milpitas, CA. You will drive process controls, evaluate new materials, and collaborate across suppliers, customers, and internal teams.

You will lead design reviews, manage qualification activities, and document tooling, BOMs, and production instructions while applying DOE, statistics, and problem-solving to ensure