Senior Microelectronic Packaging Lead Engineer (Onsite)

The Boeing Company; Pleasanton (CA); On-site; USD 146,000 - 198,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Job summary

The Boeing Company is seeking a Microelectronic Packaging Technical Lead Project Engineer to join our Secure Computing Solutions team in Pleasanton, California. This on-site role leads advanced processor packaging initiatives and collaborates with design, test, firmware, supplier management, and program teams to deliver cutting-edge solutions.

You will drive trade studies, SOW development, risk assessment, and performance metrics across the project lifecycle, ensuring schedule adherence and

Qualifications

• Bachelor of Science degree in Engineering or related field.
• 9+ years of related work experience.
• Lead the team to develop trade studies, SOWs and reviews.
• Collaborate with suppliers and cross-functional teams.
• Excellent analytical, written and verbal interpersonal skills.
• Excellent presentation skills for diverse audiences.
• Proficiency with MS Word, Excel and PowerPoint.

Responsibilities

• Lead project coordination and management for the microelectronic packaging team to support the development and delivery of processor packaging solutions, including 3D advanced packaging, ensuring alignment, schedule adherence, and effective communication across teams.
• Collaborates across a cross-functional team of processor design engineers, electronic circuit board design engineers, test engineers, field application engineers, firmware/software engineers, supplier management, program management, and others to ensure alignment of the package throughout the development lifecycle.
• Leads project execution throughout the program lifecycle, including completing and managing the statement of work, tracking progress, and defining performance metrics to ensure successful delivery.
• Coordinates the packaging team’s trade studies and source selection process to ensure effective collaboration and timely, informed decisions aligned with project objectives.
• Oversees the identification and management of risks, issues, and opportunities to protect the project’s objectives and drive successful delivery.
• Plans, identifies, and coordinates the necessary resources throughout the project or program lifecycle to ensure timely and efficient execution.
• Monitors actual results against the baseline plan—including cost and schedule—to evaluate project performance, identify efficiencies, and capture lessons learned.
• Provides leadership in project integration and execution by aligning technical and business objectives and supporting the development of project and team plans.

Skills

Leadership

Collaboration

Analytical

Presentation

MS Office

Education

Bachelor of Science in Engineering

Tools

MS Teams

MS Project

Job description

The Boeing Company is seeking a Microelectronic Packaging Technical Lead Project Engineer to join our Secure Computing Solutions team in Pleasanton, California. This on-site role leads advanced processor packaging initiatives and collaborates with design, test, firmware, supplier management, and program teams to deliver cutting-edge solutions.

You will drive trade studies, SOW development, risk assessment, and performance metrics across the project lifecycle, ensuring schedule adherence and