Senior Mechanical Engineer – RF & Thermal Systems

Echodyne Corp; Washington (District of Columbia); Vor Ort; USD 125.000 - 187.000; Vollzeit

Benefits dieser Stelle

RSU (Restricted Stock Units)

Fully-paid medical, dental, and vision

PPO or HDHP/HSA

Mental Health coverage

Travel Assistance Insurance

Company Paid Life Insurance

Short & Long Term Disability

Flexible PTO (15 days)

401(k) match

Pet Insurance

Prepaid Legal Program

Commuter Benefits

Paid Company Holidays

Zusammenfassung

Echodyne Corp is hiring a Sr. Mechanical Engineer to join our fast-growing team in the United States. You will design electro‑mechanical products, focusing on thermal, electrical and environmental aspects, and collaborate with RF, microwave, digital and antenna teams to achieve production-ready solutions.

Ideal candidates have strong SolidWorks skills, GD&T expertise, and experience with thermal/modal analysis, PCB packaging, and manufacturing processes for HP-level radar modules.

Qualifikationen

• BS or MS in Mechanical Engineering with 5+ years of experience; export-controlled data eligibility.
• Deep understanding of thermal, electrical and environmental considerations in electro‑mechanical products.
• Experience advising RF/microwave and antenna teams on mechanical constraints and production solutions.
• Advanced to expert SolidWorks skills; familiarity with GD&T per ASME Y14.5.
• Hands-on modal, stress and thermal analysis experience.

Kenntnisse

Mechanical design

PCB packaging

Thermal analysis

SolidWorks

GD&T (ASME Y14.5)

RF/microwave constraints

Modal/thermal analysis

Ausbildung

BS/MS in Mechanical Engineering

Tools

ANSYS

Jobbeschreibung

Echodyne Corp is hiring a Sr. Mechanical Engineer to join our fast-growing team in the United States. You will design electro‑mechanical products, focusing on thermal, electrical and environmental aspects, and collaborate with RF, microwave, digital and antenna teams to achieve production-ready solutions.

Ideal candidates have strong SolidWorks skills, GD&T expertise, and experience with thermal/modal analysis, PCB packaging, and manufacturing processes for HP-level radar modules.