Senior High-Speed PCB Layout Engineer – Remote

Actalent; United States; Remote; USD 69,000 - 103,000; Full time

Job summary

Actalent seeks a Senior PCB Layout Engineer to own the high-speed PCB layout for an Intel-based compute platform, taking complex designs from schematic handoff through fabrication release using Cadence Allegro.

You will collaborate with hardware, signal integrity, mechanical, and manufacturing teams to deliver robust, manufacturable, high-density boards that meet demanding performance and reliability standards.

Qualifications

• This role requires 8+ years of PCB layout experience and 2+ years with Cadence Allegro.
• Experience laying out high-performance processor platforms with BGA packages.
• Strong knowledge of impedance, length/skew matching, diff-pair routing, and crosstalk.
• Experience with constraint-driven design using Allegro Constraint Manager.
• Familiarity with IPC standards and manufacturing processes.

Responsibilities

• Lead placement, stackup definition, routing, and release of high-density PCBs.
• Implement and verify high-speed interfaces (DDR5/LPDDR5, PCIe Gen4/Gen5).
• Collaborate with hardware, SI/PI, mechanical and manufacturing teams.
• Define stackups and material selections with fabrication vendors.
• Manage BGA fanout strategies and HDI techniques.
• Create and maintain footprints and padstacks per IPC-7351.
• Produce Gerber/ODB++ files, drill files, and assembly drawings; support DFM/DFT reviews.
• Support bring-up, debug, and revision management; maintain design archives.

Skills

Cadence Allegro

HDI boards

High-speed layout

BGA fanout

Signal integrity

Power integrity

Impedance control

IPC standards

Education

Electrical/Electronics Eng Tech degree

Tools

Cadence Allegro PCB Editor

Allegro Constraint Manager

Cadence Sigrity

Job description

Actalent seeks a Senior PCB Layout Engineer to own the high-speed PCB layout for an Intel-based compute platform, taking complex designs from schematic handoff through fabrication release using Cadence Allegro.

You will collaborate with hardware, signal integrity, mechanical, and manufacturing teams to deliver robust, manufacturable, high-density boards that meet demanding performance and reliability standards.