Senior Field Applications Engineer - Packaging & Projects

Tata Electronics; Santa Clara (CA); On-site; USD 150,000 - 210,000; Full time

Job summary

Tata Electronics Private Limited (TEPL) seeks a Senior Technical Program Manager to support the VP of field application engineering. Must have hands-on semiconductor packaging experience including flip chip, bumping, and wafer-level packaging; coordinate with RnD, NPI, SCM, and Production to ensure successful customer projects.

Strong communication, problem-solving, and collaboration skills are essential to build trust and drive milestones in a fast-paced environment.

Qualifications

• Strong verbal and written communication in English is essential.
• Experience coordinating with R&D, NPI, SCM, and production teams.
• Ability to manage customer projects from initiation to delivery within schedule.

Responsibilities

• Coordinate and manage all customer project activities, including risk analysis and milestones.
• Collaborate with factory teams to resolve quality events and ensure timely delivery.
• Coordinate customer visits and audits to the factory.
• Build technical credibility and strong relationships to solve problems quickly.

Skills

Verbal and written communication

Project management

Cross-functional collaboration

Stakeholder management

Fast learner in matrix org

Education

Bachelor’s degree in engineering

Job description

Tata Electronics Private Limited (TEPL) seeks a Senior Technical Program Manager to support the VP of field application engineering. Must have hands-on semiconductor packaging experience including flip chip, bumping, and wafer-level packaging; coordinate with RnD, NPI, SCM, and Production to ensure successful customer projects.

Strong communication, problem-solving, and collaboration skills are essential to build trust and drive milestones in a fast-paced environment.