Senior Embedded Hardware Engineer - Motion & Control Leader

Koitecc Solutions; Mequon (WI); Hybrid; USD 106,000 - 159,000; Full time

Benefits offered by this job

Health Insurance including Medical, X‑

401k

Paid Time off

Parental and Caregiver Leave

Flexible Work Schedule

Job summary

Rockwell Automation is seeking an Embedded Hardware Engineer to design high‑performance electronics for global industrial applications. You will work on servo drive hardware and ICT tech, collaborating with mechanical and software teams to bring designs from concept to production.

Ideal candidates have a strong foundation in analog/mixed‑signal design, power electronics, and lab bring‑up skills. The role emphasizes EMI/EMC, thermal, and robust hardware architectures in demanding environments.

Qualifications

• Bachelor’s degree in electrical engineering or a related field.
• Advanced understanding of electrical engineering principles applied to industrial systems.
• Experience designing power supplies and embedded control hardware.

Responsibilities

• Design embedded hardware or power electronics for industrial environments.
• Contribute to hardware bring‑up, testing, and verification.
• Collaborate with mechanical, software, and power electronics teams to deliver production‑grade products.

Skills

Hardware design

Embedded systems

Power electronics

Signal integrity

EMI/EMC

Lab debugging

Python scripting

IEEE 802.3

MATLAB/Simulink

CPLD/FPGA

Education

Bachelor’s Degree in Electrical Engineering

Master’s or PhD in Electrical Engineering

Tools

MATLAB/Simulink

LTspice

HyperLynx

Maxwell

Job description

Rockwell Automation is seeking an Embedded Hardware Engineer to design high‑performance electronics for global industrial applications. You will work on servo drive hardware and ICT tech, collaborating with mechanical and software teams to bring designs from concept to production.

Ideal candidates have a strong foundation in analog/mixed‑signal design, power electronics, and lab bring‑up skills. The role emphasizes EMI/EMC, thermal, and robust hardware architectures in demanding environments.