Senior Electro-Mechanical Engineer, Advanced Packaging (2D/3D)

Lockheed Martin Corporation; Orlando (FL); On-site; USD 105,000 - 195,000; Full time

Benefits offered by this job

Medical benefits

401(k) match

Paid time off

Job summary

Lockheed Martin Corporation in Orlando, FL is seeking an Electro Mechanical Engineer for the Advanced Electronics Packaging team. You will design, prototype and test cutting-edge packaging solutions, collaborating with electrical, systems, test and product design engineers.

Gain hands-on experience with emerging semiconductor processes and flight-qualified hardware. You will mentor junior engineers, stay current with packaging technologies, and support technology readiness reviews and risk

Qualifications

• BS in Electrical or Mechanical Engineering or related STEM field from an accredited university.
• Alternatively, 12+ years of professional electromechanical experience without a degree.
• Experience in microelectronics design including CCA/PWB/PCB and flex circuits.

Responsibilities

• Conceive and model 2D/3D heterogeneous package architectures meeting SWaP targets.
• Develop detailed mechanical and electrical designs for interconnects and thermal features.
• Create and execute test plans to validate electrical, thermal and mechanical performance.
• Perform failure analysis and iterate designs from test data and manufacturability feedback.
• Prepare design documentation including drawings, BOMs, specs and verifications.
• Collaborate with electrical, systems, test and product design teams for integration.

Skills

Microelectronics design

Interconnect engineering

High-speed systems

Requirements management

Education

BS in Electrical/Mechanical Engineering or related STEM

Tools

MBSE (CAMEO)

Job description

Lockheed Martin Corporation in Orlando, FL is seeking an Electro Mechanical Engineer for the Advanced Electronics Packaging team. You will design, prototype and test cutting-edge packaging solutions, collaborating with electrical, systems, test and product design engineers.

Gain hands-on experience with emerging semiconductor processes and flight-qualified hardware. You will mentor junior engineers, stay current with packaging technologies, and support technology readiness reviews and risk