Senior Electrical Engineer - Infrared PCB & FPGA Design

Teledyne FLIR; Town of Florida (NY); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

50-year track record

Collaborative culture

Cutting-edge thermal imaging

Global tech leader

Career development

Job summary

Teledyne FLIR is seeking a Senior Electrical Engineer in Niceville, FL to design, develop, and test advanced infrared camera systems. Focus on high-performance PCB design with FPGA firmware experience preferred, collaborating with global teams across hardware, software, and manufacturing.

The role emphasizes innovative development, rigorous testing, and documentation, supporting Teledyne FLIR’s industry-leading thermal imaging products and next-generation technologies.

Qualifications

• BS or MS in Electrical Engineering, Computer Engineering, or related field.
• Experience designing, developing, and troubleshooting electronic hardware and PCBAs.
• Strong analytical and problem-solving skills.
• Effective communication, presentation, and technical writing skills.
• Proficiency with Microsoft Office applications.

Responsibilities

• Design and develop high-performance printed circuit board assemblies (PCBAs).
• Schematic capture and board layout responsibilities.
• Contribute to FPGA firmware design and development efforts.
• Test, validate, troubleshoot, and improve electronic hardware designs.
• Collaborate with multidisciplinary teams including engineers, technicians, and product managers.
• Participate in daily stand-ups, sprint planning, and project reviews.
• Document and protect innovative intellectual property.
• Create technical documentation such as manuals, notes, and reports.
• Support development of next-generation thermal imaging technologies.

Skills

PCB design

FPGA firmware design

Analytical thinking

Education

BS or MS in Electrical Engineering

Tools

Altium Designer

Intel/Altera Quartus

Job description

Teledyne FLIR is seeking a Senior Electrical Engineer in Niceville, FL to design, develop, and test advanced infrared camera systems. Focus on high-performance PCB design with FPGA firmware experience preferred, collaborating with global teams across hardware, software, and manufacturing.

The role emphasizes innovative development, rigorous testing, and documentation, supporting Teledyne FLIR’s industry-leading thermal imaging products and next-generation technologies.