Senior Electronics Engineer - Thermal Imaging & PCBs

FLIR Systems, Inc.; Town of Florida (NY); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Relocation assistance

Competitive compensation and benefits

Job summary

Teledyne FLIR is seeking a Senior Electronics Engineer onsite in Niceville, Florida to design, develop, and test advanced infrared camera systems. You will focus on high-performance PCB design, explore FPGA firmware, and collaborate with engineers, technicians, and product managers on cross-functional projects.

The role involves global collaboration, relocation assistance for qualified candidates, and opportunities to work on cutting-edge thermal imaging technology within a leading company.

Qualifications

• BS or MS in Electrical Engineering, Computer Engineering, or a related field.
• Experience designing, developing, and troubleshooting electronic hardware and PCBAs.
• Strong analytical and problem-solving skills.
• Effective communication, presentation, and technical writing skills.

Responsibilities

• Design and develop high-performance printed circuit board assemblies (PCBAs), including schematic capture and board layout
• Contribute to FPGA firmware design and development efforts
• Test, validate, troubleshoot, and improve electronic hardware designs
• Collaborate with multidisciplinary teams including engineers, technicians, and product managers
• Participate in daily stand-ups, sprint planning, project reviews, and technical discussions
• Create technical documentation including product manuals, application notes, and technical reports
• Support the development of next-generation thermal imaging technologies

Skills

PCB design

FPGA development

Hardware testing

Schematic capture

Cross-functional collaboration

Technical writing

Education

BS or MS in Electrical Engineering or Computer Engineering

Tools

Altium Designer

Intel/Altera Quartus

Job description

Teledyne FLIR is seeking a Senior Electronics Engineer onsite in Niceville, Florida to design, develop, and test advanced infrared camera systems. You will focus on high-performance PCB design, explore FPGA firmware, and collaborate with engineers, technicians, and product managers on cross-functional projects.

The role involves global collaboration, relocation assistance for qualified candidates, and opportunities to work on cutting-edge thermal imaging technology within a leading company.