Senior DRAM Failure Analysis Engineer - Root Cause & Data

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 150,000; Full time

Job summary

Micron Technology, Inc. is seeking a Sr. Engineer – DRAM Failure Analysis to lead electrical and physical failure investigations on DRAM components at our Boise, Idaho facility.

The role emphasizes data-driven analysis, root-cause determination, and collaboration with yield teams across engineering. The successful candidate will mentor FA technicians, analyze complex defect data, and prepare comprehensive reports summarizing findings and potential root causes.

Qualifications

• Physical failure analysis for DRAM memory components.
• Data analysis to support failure analysis results in pursuit of root cause.
• PFA tools including SEM, FIB, and TEM.
• Elemental analysis using EELS and EDS mapping tools.

Responsibilities

• Perform Electrical and Physical Failure Analysis (EFA/PFA) investigative work for defect issues.
• Monitor probed material and categorize dead die into known defect issue categories and investigate new/unknown issues.
• Perform advanced data analysis and document findings for part owners.
• Mentor FA technicians with yield investigations and complex FA testing.

Skills

Failure analysis

Root-cause analysis

Data analysis

Yield troubleshooting

Education

Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, or related field

Tools

Scanning Electron Microscope

Focused Ion Beam

Transmission Electron Microscope

EELS

EDS mapping

Job description

Micron Technology, Inc. is seeking a Sr. Engineer – DRAM Failure Analysis to lead electrical and physical failure investigations on DRAM components at our Boise, Idaho facility.

The role emphasizes data-driven analysis, root-cause determination, and collaboration with yield teams across engineering. The successful candidate will mentor FA technicians, analyze complex defect data, and prepare comprehensive reports summarizing findings and potential root causes.