Senior DRAM BEOL Process Engineer - Innovation

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Holiday pay

Job summary

Micron Technology in Boise, Idaho invites a Sr BEOL Engineer to join the DRAM Research & Development team. You will help develop and optimize BEOL process flows, collaborate with module, device, reliability and manufacturing engineers, and drive yield improvements through data analysis and tool-based optimization.

Ideal candidates have foundational BEOL knowledge, hands-on deposition or etch experience, and a drive to learn advanced interconnect technologies in a fast-paced R&D setting.

Qualifications

• BS or higher in a related engineering discipline with coursework in thin films or interconnects.
• Foundational understanding of BEOL concepts and semiconductor fabrication.
• Hands-on deposition or etch experience and data analysis for yield/reliability.

Responsibilities

• Support BEOL flow development and integration for advanced DRAM technologies.
• Troubleshoot integration issues across multiple process modules.
• Analyze process and electrical data to drive yield and reliability improvements.
• Collaborate with module, device, reliability, and manufacturing teams.
• Participate in tech transfer from R&D to pilot production.
• Learn statistical methods and apply them to process optimization.

Skills

Semiconductor knowledge

Statistical analysis

Cross-functional collaboration

Education

BS in Electrical Engineering

MS/PhD preferred in related field

Tools

CVD

ALD

PVD

DOE

JMP

Python

R

SEM

TEM

XRD

Job description

Micron Technology in Boise, Idaho invites a Sr BEOL Engineer to join the DRAM Research & Development team. You will help develop and optimize BEOL process flows, collaborate with module, device, reliability and manufacturing engineers, and drive yield improvements through data analysis and tool-based optimization.

Ideal candidates have foundational BEOL knowledge, hands-on deposition or etch experience, and a drive to learn advanced interconnect technologies in a fast-paced R&D setting.