Pioneering DRAM Process Integration Engineer

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 140,000 - 210,000; Full time

Job summary

Micron Technology in Boise, Idaho, seeks an Advanced DRAM Process Integration Engineer to drive device concepts and materials integration for next-generation memory. You will design experiments in the R&D fab, analyze data, and partner across teams to translate innovative concepts into scalable processes.

The role requires expert knowledge in semiconductor device physics, 5+ years of experience, and a track record of innovation.

Qualifications

• PhD or MS in Electrical Engineering, Materials Science, Applied Physics, or a related field.
• 5+ years of relevant industry experience.
• Strong foundation in semiconductor device physics and process integration.
• Demonstrated record of innovation through patents, publications, or product-relevant solutions.
• Strong analytical and quantitative problem-solving skills.
• Experience with TCAD, physics-based modeling, and materials characterization.

Responsibilities

• Identify and evaluate novel device concepts and material systems to support upcoming scaling and performance improvements.
• Apply a deep understanding of semiconductor device physics and first-principles analysis to guide design trade-offs.
• Lead technology integration activities, aligning device concepts and process flows into cohesive, actionable solutions.
• Design and manage experiments in the R&D fab to optimize device performance and manufacturability.
• Analyze inline, parametric, and probe data to evaluate operating mechanisms and sources of variability.
• Partner with process development, modeling, and design teams to communicate complex technical findings and trade-offs.

Skills

semiconductor device physics

process integration

analytical thinking

problem solving

Education

PhD in Electrical Engineering, Materials Science, Applied Physics, or related field

MS in Electrical Engineering, Materials Science, Applied Physics, or related field

Tools

TCAD

Physics-based modeling

Materials characterization

Job description

Micron Technology in Boise, Idaho, seeks an Advanced DRAM Process Integration Engineer to drive device concepts and materials integration for next-generation memory. You will design experiments in the R&D fab, analyze data, and partner across teams to translate innovative concepts into scalable processes.

The role requires expert knowledge in semiconductor device physics, 5+ years of experience, and a track record of innovation.