DRAM Process Integration Lead — Architecture & Yield

Micron Technology; Boise (ID); On-site; USD 120,000 - 150,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology in Boise, Idaho, is seeking a DRAM Process Integration Engineer to drive technology integration for new DRAM architectures. You will lead the development and optimization of process flows, influencing future memory performance.

The ideal candidate will have a strong background in semiconductor technologies and project management. Benefits include comprehensive healthcare options, paid time-off, and a commitment to equal opportunity.

Qualifications

• 5+ years of relevant semiconductor industry experience.
• Detailed knowledge of mainstream memory technologies (DRAM, NAND).
• Strong functional understanding of device physics and materials science.

Responsibilities

• Lead technology integration activities to enable advanced memory devices.
• Develop and integrate new device architectures through productization.
• Drive continuous yield improvement by analyzing inline and defect data.

Skills

Knowledge of semiconductor process integration

Project management skills

Experiment design and data analysis

Collaboration with technical teams

Familiarity with AI applications

Education

MS or PhD in engineering or relevant technical field

Job description

Micron Technology in Boise, Idaho, is seeking a DRAM Process Integration Engineer to drive technology integration for new DRAM architectures. You will lead the development and optimization of process flows, influencing future memory performance.

The ideal candidate will have a strong background in semiconductor technologies and project management. Benefits include comprehensive healthcare options, paid time-off, and a commitment to equal opportunity.