Senior Director, Mechanical & Thermal Eng - Hyperscale AI

Cisco Systems, Inc; San Jose (CA); On-site; USD 285,000 - 391,000; Full time

Job summary

Cisco Systems, Inc. invites a Senior Director of Mechanical and Thermal Engineering to lead a high-impact, multidisciplinary group shaping next-generation mechanical and thermal systems across networking hardware.

You will drive simulation, experimental validation, and multi-functional optimization to advance package, board, and system technologies. You will collaborate with Silicon Design, Manufacturing, and QA, directing end-to-end projects, defining roadmaps, and ensuring quality and

Qualifications

• Bachelor’s degree in Mechanical Engineering or related field, or equivalent practical experience.
• 14+ years engineering experience in mechanical/thermal engineering in hardware domains.
• 5+ years direct technical leadership overseeing multidisciplinary teams.
• Experience in mechanical enclosure design and thermal systems for electronic hardware.

Responsibilities

• Lead a multi-disciplinary team of engineering managers and engineers.
• Oversee end-to-end mechanical and thermal projects aligning with schedules and goals.
• Design and optimize enclosures, cooling, tolerances, and reliability.
• Scale engineering standards using AI/ML and optimization techniques.
• Ensure all hardware designs comply with IEEE standards and safety regulations.
• Collaborate with Product Development, Silicon Design, Electrical Engineering, Supply Chain, and QA.

Skills

Mechanical engineering

Thermal engineering

Leadership

Enclosures design

Thermal system design

DFR design

AI/ML in design

Project management

Cross-functional collaboration

Education

Bachelor's degree in Mechanical Engineering or related field

Tools

Simulation software

AI/ML tools

CAD tools

Job description

Cisco Systems, Inc. invites a Senior Director of Mechanical and Thermal Engineering to lead a high-impact, multidisciplinary group shaping next-generation mechanical and thermal systems across networking hardware.

You will drive simulation, experimental validation, and multi-functional optimization to advance package, board, and system technologies. You will collaborate with Silicon Design, Manufacturing, and QA, directing end-to-end projects, defining roadmaps, and ensuring quality and