Senior Digital PCB Design Engineer: High-Speed Bring-Up

Experis Austria; Redmond (WA); Presencial; USD 83 000 - 103 000; Tempo integral

Resumo da oferta

Experis is seeking a Sr. Electrical Design Engineer III in Redmond, WA to own digital board design end-to-end, from schematic through bring-up and validation. The role emphasizes high-speed digital design, signal integrity, and lab testing with a strong prefered Siemens Xpedition tool chain.

The successful candidate will collaborate with cross-functional teams on complex multi-layer PCBs, clocking, resets, and DMA/IO interfaces, delivering robust hardware for demanding applications.

Qualificações

• Bachelor’s degree in electrical engineering and hands-on digital hardware design experience.
• Ownership of a complex digital board from schematic through bring‑up and validation.
• Experience with high-speed digital design fundamentals and interfaces.

Responsabilidades

• Design multi-layer digital PCBs with schematic capture and component selection.
• Define high-speed digital interfaces, pin planning, and interface budgeting.
• Own clocking, resets, boot/configuration, and I/O for the digital subsystem.
• Perform signal‑integrity analysis and translate results into routing constraints.
• Collaborate on routing with layout for dense, high-pin-count devices.
• Bring-up digital boards, test and debug hardware with lab instrumentation.
• Write test plans and drive root-cause analysis across operating conditions.
• Support hardware/firmware/software integration and documentation.

Conhecimentos

High-speed digital design

Signal integrity

Lab instrumentation

Schematic/PCB bring-up

Formação académica

Bachelor’s degree in Electrical Engineering

Ferramentas

Siemens Xpedition

Descrição da oferta de emprego

Experis is seeking a Sr. Electrical Design Engineer III in Redmond, WA to own digital board design end-to-end, from schematic through bring-up and validation. The role emphasizes high-speed digital design, signal integrity, and lab testing with a strong prefered Siemens Xpedition tool chain.

The successful candidate will collaborate with cross-functional teams on complex multi-layer PCBs, clocking, resets, and DMA/IO interfaces, delivering robust hardware for demanding applications.