Senior Die Process Engineer: Stamping & Tooling Innovator

Stellantis Financial Services; Auburn Hills (MI); On-site; USD 90,000 - 130,000; Full time

Job summary

Stellantis Financial Services seeks a Die Process Engineer to develop, validate, and optimize die processes from early studio concepts through production launch. You will collaborate across stamping, product engineering, quality, assembly, and external suppliers to deliver high‑quality panels and robust tooling performance.

Responsibilities include defining die processes, ensuring surface, dimensional, and throughput targets, and supporting tool build, tryout, and launch readiness while driving

Qualifications

• Bachelor’s degree in Engineering required.
• Minimum 6 years of die experience with expertise in die process/design/feasibility.
• Strong understanding of press operations and die automation systems.
• Ability to read and interpret Forming Simulation, GD&T, FLD, and CMM reports to drive corrective actions.

Responsibilities

• Review, define, and optimize die processes for assigned components.
• Determine part orientation, die type, and process flow to meet targets.
• Develop preliminary 6-Box processes and create NX models for tooling concept.
• Establish trim, form, and secondary operations to meet quality/production requirements.
• Lead buyoffs and support readiness for shipment.

Skills

Excellent communication

Reading GD&T/FLD/CMM reports

Microsoft Office proficiency

Travel ability (domestic & intl)

Education

Bachelor's degree in Engineering

Bachelor's degree or advanced degree in Engineering

Tools

Catia

NX

Teamcenter

MEDDS

DDP

SharePoint

Job description

Stellantis Financial Services seeks a Die Process Engineer to develop, validate, and optimize die processes from early studio concepts through production launch. You will collaborate across stamping, product engineering, quality, assembly, and external suppliers to deliver high‑quality panels and robust tooling performance.

Responsibilities include defining die processes, ensuring surface, dimensional, and throughput targets, and supporting tool build, tryout, and launch readiness while driving