Senior Design Engineer/Architect, HBM

Micron Technology, Inc.; Richardson (TX); On-site; USD 130,000 - 200,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Retirement benefits

Job summary

Micron Technology, Inc. seeks a skilled engineer to architect and optimize high-speed datapath circuitry for next-gen HBM products. You will define system requirements and I/O processes, and collaborate across design, PHY, ECC, verification, layout, and system teams to ensure robust datapath performance.

The role involves silicon bring-up support and resolving design and program challenges, with a focus on JEDEC and custom HBM solutions. On-site in Richardson, TX with strong growth opportunities.

Qualifications

• Bachelor's or Master’s in Electrical/Computer Engineering with relevant experience.
• Experience architecting, designing, or optimizing high-speed datapath circuitry.
• Ability to define and implement complex system requirements and I/O processes.
• Experience coordinating subsystem design and system integration activities.
• Ability to work across design, PHY, ECC, verification, layout, and system teams.

Responsibilities

• Architect, design, and optimize logic-die and core-die datapath circuitry for next-gen HBM products.
• Define system specifications, I/O processes, and parameters for hardware/software compatibility; leverage AI to enhance analysis.
• Coordinate subsystem design and integration across multi-functional teams.
• Identify and resolve system or program support deficiencies.
• Develop corrective actions to ensure robust datapath performance.

Skills

Datapath architecture

System requirements

I/O specifications

System integration

Education

Bachelor's in EE/CE

Master's in EE/CE

PhD (preferred)

Tools

JEDEC standards

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production.

This position focuses on architecting, designing, and optimizing high‑speed datapath circuitry for JEDEC and custom HBM solutions. The role defines complex system requirements, ensures subsystem integration, and supports development through silicon bring‑up while resolving design and program support challenges.

Responsibilities:

• Architect, design, and optimize logic‑die and core‑die datapath circuitry for next‑generation HBM products.
• Determine system specifications, input/output processes, and working parameters for hardware/software compatibility, leveraging AI to enhance analysis and decision‑making.
• Coordinate subsystem design and integration across multi‑functional teams.
• Identify, analyze, and resolve system or program support deficiencies.
• Develop and recommend corrective actions to ensure robust datapath performance.

Minimum Qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 4 years of relevant industry experience or a Master’s degree in Electrical Engineering, Computer Engineering, or a related field with 2 years of relevant industry experience.
• Experience architecting, designing, or optimizing high‑speed datapath circuitry.
• Ability to define and implement complex system requirements, identify issues, analyze root causes, and recommend corrective actions.
• Experience determining hardware/software system specifications and I/O processes.
• Experience coordinating subsystem design and system integration activities.

Preferred Qualifications:

• PhD in Electrical Engineering, Computer Engineering, or related field
• Experience working with JEDEC or custom HBM solutions.
• Experience collaborating with design, PHY, ECC, verification, layout, or system engineering teams.

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time‑off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.