Senior CMP Process Engineer - Drive Wafer Flatness & Yield

Samsung Electronics America; Taylor (TX); On-site; USD 106,000 - 145,000; Full time

Benefits offered by this job

Medical insurance

Dental & vision insurance

401(k) matching

Paid time off and holidays

Onsite facilities

Job summary

Samsung Austin Semiconductor seeks a CMP Process Engineer to manage planarization of wafer surfaces during CMP, controlling chemical reactions and mechanical force to achieve a flat wafer surface. The role involves optimizing conditions, recipes, and defect reduction while ensuring high yield and compatibility with subsequent fabrication steps.

The position offers a base salary in the $106,000–$145,000 range with a comprehensive benefits package and eligibility for incentive programs based on

Qualifications

• CMP knowledge including slurry-pad-conditioning interactions and post-clean steps.
• Hands-on familiarity with major CMP tools: AMAT/EBara and end point systems.
• Experience in SPC, FDC, and analysis software like JMP or Spotfire.
• Ability to drive root-cause analysis using FMEA, 8D and first-principles physics.
• Flexibility to work off-hours and various shift schedules.
• Familiarity with metrology tools like Ellipsometry, SEM, AFM for thickness/roughness checks.
• Experience reducing defects and understanding Fab integration with CMP effects.

Responsibilities

• Removal Rate (RR) control to ensure uniform thickness across wafers.
• Optimize process conditions to improve uniformity and reduce center low RR profiles.
• Develop and optimize Recipe (RCP) parameters and improve flatness.
• Manage defects and wafer uniformity, addressing scratches/particles.
• Monitor consumable lifecycles (pads, slurry) to avoid specification breaches.
• Evaluate slurries and polishing pads to optimize CMP performance.

Skills

CMP knowledge

Statistical methods

Problem solving

DOE mindset

Data analysis

Flexibility

Education

Bachelor's degree in Engineering

Tools

AMAT/EBara equipment

End point systems

JMP

Spotfire

Ellipsometry

SEM

AFM

Job description

Samsung Austin Semiconductor seeks a CMP Process Engineer to manage planarization of wafer surfaces during CMP, controlling chemical reactions and mechanical force to achieve a flat wafer surface. The role involves optimizing conditions, recipes, and defect reduction while ensuring high yield and compatibility with subsequent fabrication steps.

The position offers a base salary in the $106,000–$145,000 range with a comprehensive benefits package and eligibility for incentive programs based on