Senior Cloud Hardware & Packaging Engineer, NPD

Amazon Web Services (AWS); Prescott (AZ); On-site; USD 150,000 - 190,000; Full time

Job summary

Amazon Web Services (AWS) is seeking a Sr. Cloud Hardware Development Engineer (CHDE) to join the Network Product Development team.

You will enable the components that form the backbone of AWS network interconnect, performing high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications. Collaborate with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust packaging solutions at scale, shaping the

Qualifications

• Experience in IC/SOC packaging design and development.
• Familiar with test plans for high-speed electronics.
• Ability to collaborate with design, manufacturing, and operations teams.

Responsibilities

• Collaborate with vendors and teams to evaluate packaging technologies and create implementation plans.
• Develop and automate test plans for package characterization (signal integrity, power integrity, thermal, mechanical).
• Define and develop test plans for IC/SOC packages, substrates, and interconnects.
• Work with operations to identify quality issues and improve yields.

Skills

Packaging expertise

Hardware design

Cross-functional collaboration

Job description

Amazon Web Services (AWS) is seeking a Sr. Cloud Hardware Development Engineer (CHDE) to join the Network Product Development team.

You will enable the components that form the backbone of AWS network interconnect, performing high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications. Collaborate with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust packaging solutions at scale, shaping the