Senior Cloud Hardware Packaging Engineer – IC/SOC

Amazon Web Services (AWS); Cupertino (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Amazon Web Services (AWS) is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development team.

You will enable IC and SOC packaging for high-speed interconnects, designing, validating, and sustaining robust packaging solutions at scale. You will collaborate with design teams, manufacturers, and cross-functional partners to deliver reliable hardware components, automate test plans, and improve yields while supporting AWS data center

Qualifications

• Packaging expertise required for IC/SOC packaging
• Experience designing, validating and sustaining packaging for high-speed interconnects

Responsibilities

• Collaborate with vendors/manufacturers to evaluate packaging technologies and define roadmaps.
• Develop and automate test plans for package characterization including signal integrity, power integrity, thermal performance, and mechanical reliability.
• Work with operations to identify quality issues and optimize yields for packaged components.
• Provide robust packaging solutions that scale across AWS data centers.

Skills

Packaging expertise

IC/SOC packaging design

Hardware development

Job description

Amazon Web Services (AWS) is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development team.

You will enable IC and SOC packaging for high-speed interconnects, designing, validating, and sustaining robust packaging solutions at scale. You will collaborate with design teams, manufacturers, and cross-functional partners to deliver reliable hardware components, automate test plans, and improve yields while supporting AWS data center