Senior Analog & Mixed-Signal Hardware Architect (LiDAR)

Voyant-Photonics

New York (NY)

On-site

USD 140,000 - 220,000

Full time

6 days ago
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Benefits offered by this job

Equity package
Health benefits
Unlimited PTO
Team events

Job summary

Voyant Photonics is seeking a Senior Hardware Engineer to lead analog & mixed-signal design for LiDAR modules in NYC. You’ll own critical trade-offs, set design standards, and mentor a growing hardware team.

The role demands 10+ years of hands-on hardware experience, deep expertise in low-noise analog design, signal integrity, and power integrity, with cross-functional collaboration across systems, firmware, and packaging.

Qualifications

  • 10+ years in hands-on hardware development with end-to-end ownership of multiple high-volume systems.
  • Demonstrated leadership setting technical direction for a team or product line.

Responsibilities

  • Define the analog and mixed-signal architecture for next-generation LiDAR modules.
  • Act as technical authority on signal integrity, power integrity, and EMI/EMC across the product line.
  • Lead bring-up, characterization, and validation strategy (EVT/DVT/PVT) across multiple programs.
  • Own design trade-offs shaping roadmap and unit economics.
  • Mentor engineers and provide technical direction in cross-functional reviews.
  • Drive supplier and component strategy for critical analog parts.
  • Represent hardware engineering in deep-dive discussions with customers and partners.

Skills

Low-noise analog
High-speed digital design
Signal integrity
Power integrity

Tools

Schematic capture
SPICE
Altium
HyperLynx
SiWave
FPGAs

Job description

Voyant Photonics is seeking a Senior Hardware Engineer to lead analog & mixed-signal design for LiDAR modules in NYC. You’ll own critical trade-offs, set design standards, and mentor a growing hardware team.

The role demands 10+ years of hands-on hardware experience, deep expertise in low-noise analog design, signal integrity, and power integrity, with cross-functional collaboration across systems, firmware, and packaging.

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