Failure Analysis Technician F21

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Arizona; On-site; USD 60,000 - 80,000; Full time

Job summary

TSMC - Taiwan Semiconductor Manufacturing Company Limited in Arizona is seeking a Failure Analysis Technician to support chip failure analysis. Responsibilities include operating complex tools like FIB and SEM for sample preparation and assisting engineers with analytical methods. Candidates should have an associate or bachelor's degree in a relevant field, experience in semiconductor sample preparation, and basic PC skills. This role may involve shift work and clean room environments.

Qualifications

• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm) is preferred.
• Experience/skill in HR-STEM imaging and EDS analysis is preferred.
• Ability to work independently, prioritize tasks, and meet deadlines.

Responsibilities

• Operate FIB to prepare PFA samples, SEM, C-AFM, and nano-probe tools for analysis.
• Prepare TEM samples, including site marking, de-layering, and necessary treatments.
• Assist engineers with analytical method development.

Skills

TEM sample preparation

HR-STEM imaging

EDS analysis

Basic PC skills

Independence

Teamwork

Pressure handling

Education

Associate degree or Bachelor’s degree in Science/Engineering/Technology

Tools

FIB

SEM

C-AFM

nano-probe tools

Job description

Failure Analysis Technician

TSMC Arizona, located in the 5‑nanometer fab in Phoenix, Arizona, is looking for a Failure Analysis Technician. The role requires a strong sense of chip failure analysis and a commitment to integrity, innovation, and customer trust.

Responsibilities:

• Operate FIB to prepare PFA samples, SEM, C‑AFM and nano‑probe tools for analysis and reporting.
• Prepare TEM samples, including site marking, de‑layering, and other necessary pre‑treatment steps.
• Handle chemicals safely with PPE.
• Collect and organize data and report to engineers.
• Assist engineers with analytical method development.
• Maintain laboratory housekeeping (6S) environment and protocols.
• Support Fab manufacturing operations and participate in on‑call schedule.

Minimum Qualifications:

• Associate degree (A.A.S.) or Bachelor’s degree in Science/Engineering/Technology or equivalent education (preferred but not required).
• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm) (preferred but not required).
• Experience/skill in HR‑STEM imaging and EDS analysis (preferred but not required).
• Ability to work independently, prioritize tasks, and meet deadlines.
• Team player with a positive attitude and strong work ethic.
• Ability to handle pressure in a fast‑paced environment.
• Availability for night and weekend shifts, and overtime when needed.
• Possible work in a clean room environment (Near‑line FIB/TEM).
• Basic PC skills (MS Windows OS and MS Office) required.

Work Location: Phoenix, AZ

Training Location: Phoenix, AZ

Travel: 0%