Section Manager - YE/Defect Metrology (SM1)

118-WW TMG MFG OPS; United States; On-site; USD 150,000 - 190,000; Full time

Job summary

Texas Instruments in the United States is seeking a Section Manager, YE/Defect Metrology to lead factory-wide defect metrology strategies, drive yield improvement initiatives, and guide a team of engineers and technicians in defectivity reduction and process control.

This high-visibility role involves shaping TI's long-term yield roadmap for a 300mm wafer fabrication environment while building a high-performing engineering organization.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering or Physics (or related field).
• Minimum 5 years of direct engineering or technical team leadership experience in semiconductors.

Responsibilities

• Lead factory-wide defect metrology, defectivity reduction, and excursion management.
• Drive workforce planning, performance management, and talent development.
• Oversee SPC governance and manufacturing quality systems for process stability.
• Collaborate with process, integration, operations, and quality teams on defect control.
• Present performance updates and roadmaps to site leadership.
• Champion AI-enabled manufacturing and data-driven decision support.

Skills

Team leadership

Defect metrology

SPC

AI analytics

Cross-functional collaboration

Executive communication

Manufacturing data analysis

Education

Electrical Engineering

Materials Science

Chemical Engineering

Physics

Job description

Why Texas Instruments

At Texas Instruments, we design and manufacture semiconductors that power electronics across the world. Our 300mm manufacturing facilities represent some of the most advanced wafer fabrication environments in the industry. We invest in our people, our technology, and our manufacturing capabilities and we are looking for leaders who want to make a meaningful impact at scale.

About the Role

Texas Instruments is seeking an experienced and results-driven Section Manager, YE/Defect Metrology to join our 300mm semiconductor manufacturing organization. In this leadership role, you will own factory-wide defect metrology strategies, drive yield improvement initiatives, and lead a team of engineers and technicians focused on defectivity reduction, excursion management, and manufacturing process control.

This is a high-visibility position with direct engagement with site leadership. You will play a critical role in shaping the long-term yield roadmap for TI's advanced wafer fabrication environment while building and developing a high-performing engineering team.

What You'll Do

Team Leadership & Organization Management

• Lead, develop, and grow a team of engineers and technicians responsible for factory-wide defect metrology, defectivity reduction, and excursion management
• Drive workforce planning, performance management, succession planning, and talent development within the section
• Foster a culture of operational excellence, accountability, and continuous improvement

Yield Enhancement & Defect Metrology

• Define and execute factory-wide defect control strategies across production tools spanning multiple technology nodes
• Lead excursion detection, containment, and root cause resolution in a high-volume 300mm wafer fabrication environment
• Develop and deploy monitoring methodologies that improve excursion detection speed (MTTD) and accelerate operational response (MTTR)
• Expand automated containment capabilities including auto-inhibit and response systems to reduce manufacturing exposure risk

Process Control & Quality Systems

• Oversee Statistical Process Control (SPC) governance and manufacturing quality systems to ensure sustained process stability
• Drive standardization of manufacturing control methodologies across multiple technology platforms
• Maintain compliance with customer, ISO, IATF, and internal quality audit standards

Cross-Functional Collaboration & Executive Engagement

• Partner with process engineering, integration, operations, equipment engineering, and quality teams to coordinate defect control execution
• Provide operational briefings on significant defect events, containment actions, and excursion status to senior and executive site leadership
• Present factory performance reviews, MTTD/MTTR roadmaps, and yield improvement updates to site management

Digital Transformation & Innovation

• Champion AI-enabled manufacturing and data-driven decision-support initiatives focused on defect analysis and engineering productivity
• Lead and contribute to continuous improvement programs that advance factory-wide yield, quality, and operational performance
• Support cross-site benchmarking and best-practice sharing across TI's global manufacturing network

Minimum requirements:

• Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field.
• 5 years of direct engineering or technical team leadership/management experience within the semiconductor industry.

Preferred qualifications:

• Experience managing teams of 8 or more engineers and technicians
• Experience in defectivity reduction, excursion management, and SPC in a high-volume wafer fabrication environment
• Hands-on experience in 300mm wafer fabrication across multiple technology nodes
• Familiarity with MTTD/MTTR frameworks and operational performance metric development
• Experience developing or deploying AI-enabled manufacturing solutions or advanced analytics tools
• Background in ISO, IATF, or equivalent quality management systems and audit compliance
• Track record of measurable yield improvement and scrap avoidance in a high-volume production environment
• Experience supporting multi-site or corporate-level benchmarking and manufacturing governance initiatives
• Proven ability to engage and present to senior and executive leadership on factory performance topics
• Strong cross-functional collaboration and project management skills