RF Front-End Module Design Intern (5G/6G)

Skyworks Solutions, Inc; San Jose (CA); On-site; USD 40,000 - 68,000; Full time

Job summary

Skyworks Solutions, Inc. in San Jose, CA is seeking a Module Integration Design Engineering Intern to contribute to the development of advanced RF front-end modules for 5G smartphone applications.

You will collaborate with cross-functional teams to integrate high-performance hardware into a single, optimized multi-chip module. The role emphasizes HFSS EM modeling, simulations, and lab data collaboration, with mentorship and opportunities for future full-time roles.

Qualifications

• Master's or PhD in Electrical Engineering required
• Minimum GPA of 3.0
• Coursework and/or experience in RF and analog circuit design
• Strong understanding of impedance matching and RF/microwave parameters
• Hands-on experience with simulation and EDA tools (ADS, HFSS, Momentum, Cadence, EMX, AWR)
• Strong problem-solving skills and clear communication
• Self-starter with good organizational and scheduling skills
• Detail-oriented to ensure high-yielding design and delivery

Responsibilities

• Contribute to the design of RF front-end modules (RF-FEM), including power amplifiers, SOI dies, filter dies, and SMDs, ensuring target performance within size, cost, footprint, and schedule constraints
• Build complex HFSS EM models of multi-functional RF front-end modules to maximize performance and minimize coupling and shielding effects
• Conduct full module simulations (FMS) across functional states to identify issues and propose solutions to improve margins relative to specifications
• Collaborate with team members to contribute design schematics, simulations, and real lab data

Job description

Skyworks Solutions, Inc. in San Jose, CA is seeking a Module Integration Design Engineering Intern to contribute to the development of advanced RF front-end modules for 5G smartphone applications.

You will collaborate with cross-functional teams to integrate high-performance hardware into a single, optimized multi-chip module. The role emphasizes HFSS EM modeling, simulations, and lab data collaboration, with mentorship and opportunities for future full-time roles.