Electromagnetics (EM) and Packaging Design Engineer

Texas Instruments; Dallas (TX); On-site; USD 110,000 - 160,000; Full time

Job summary

Texas Instruments Kilby Labs seeks an electromagnetic modeling engineer to support RF design for Silicon Photonics, RF filters and 2.5D/3D heterogeneous systems. You will work across ATD, packaging, chip design and test to deliver innovative, high-performance, cost-effective solutions.

Responsibilities include driving high-frequency interconnect simulations, building EM models for active and passive structures, and performing HFSS/EMX simulations with extracted S-parameters for circuit-level

Qualifications

• Experience in RF design and electromagnetics required.
• Ability to build and analyze EM models for RF passive structures.
• Familiarity with high-frequency interconnects and 2.5D/3D systems.

Responsibilities

• Drive high-frequency interconnect simulations for product developments.
• Lead electromagnetic modeling for advanced packages and 2.5D/3D systems.
• Build EM models of RF passive structures (filters, baluns, couplers).
• Perform HFSS and EMX simulations; analyze S-parameters for circuit-level work.
• Collaborate with ATD, packaging, chip design and test teams.

Skills

RF modeling

HFSS

EMX

RF simulations

3D integration

Tools

HFSS

EMX

Job description

We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.

Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers.

As a member of Kilby Labs you’ll have the chance to interact with many product groups and functions, work with an interdisciplinary team, and bridge from lab to fab to develop technologies to enable new markets.

About the Position

Kilby Labs is seeking a highly motivated and experienced electromagnetic modeling engineer to support various TI product development, including Silicon Photonics, RF filters and 2.5D/3D heterogeneously integrated systems. This role is responsible for the RF modeling of new technology platforms and product ideas. The role requires working extensively across other internal teams including advanced process technology development (ATD), packaging, chip design and test, and product engineering, to make innovative, high performance and cost-effective solutions. This position is ideal for individuals interested in RF design, electromagnetics, filter design, RFIC and module co-design, and advanced/heterogeneous packaging technologies. For this role we are seeking a creative problem-solver who can develop unique and breakthrough solutions.

Responsibilities may include, but are not limited to:

• Drive and execute the strategy of high frequency and high-speed interconnect simulations for various product developments.
• Lead the electromagnetic modeling needs of the team for various applications; such as advanced packages, TSVs, heterogeneously integrated 2.5D/3D systems.
• Build and analyze electromagnetic models of RF passive structures, including: filters, matching networks, baluns, couplers, RF transitions and interconnects.
• Perform electromagnetic simulations using tools such as HFSS and EMX
• With extracted S-parameters, run circuit and system-level simulations.
• Investigate RF interactions between the circuits, package structures, and passive components.
• Drawing mask layouts for test structures for proof-of-concept studies, as well as supporting technology development activities
• Evaluate design trade-offs related to performance, and manufacturability.