Remote: Staff R&D & Data Interconnect Architect

TE Connectivity Corporation; Town of Texas (WI); Remote; USD 141,000 - 212,000; Full time

Job summary

TE Connectivity is seeking a STAFF R&D/PRODUCT DVL ENGINEER to shape the system architecture for next-generation compute, AI, storage and networking. You will engage with customers, translate needs into roadmaps, and influence product direction across TE’s interconnect platform.

The role emphasizes collaboration with engineering, R&D and marketing, with a remote-friendly setup and frequent travel to customer sites and conferences.

Qualifications

• 8+ years of experience in compute, networking, AI, or storage system design and high-speed interconnect technologies.
• Knowledge of compute, AI/ML, networking, and storage architectures.
• Knowledge of hardware and associated signaling environments.
• Technical expertise in high-speed engineering and design.
• Familiarity with industry standards like PCIe, CXL, Ethernet, and InfiniBand.
• Experience with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis).
• Strong analytical and problem-solving skills, with experience in design trade-offs for power, latency, and scalability.

Responsibilities

• Act as one of the key technical interfaces for hyperscalers, OEMs, and system architects, to gain insights into next-generation compute, AI, storage, and networking challenges.
• Identify and assess technology disruptors, translating emerging trends into strategic R&D initiatives and product development roadmaps to maintain TE’s industry leadership.
• Cultivate and strengthen customer partnerships, fostering co-development opportunities and collaborative innovation to accelerate next-gen infrastructure advancements.
• Support internal stakeholders, including product development, R&D, and sales teams, by providing technical guidance on next-gen interconnect technologies.
• Define high-level system architecture requirements, ensuring TE’s product roadmap is aligned with next-generation compute, AI, and networking ecosystems.
• Bridge the gap between customer needs and TE’s technology roadmap, ensuring TE delivers future-proof, scalable, and high-performance interconnect solutions tailored to the evolving data infrastructure landscape.
• Drive TE’s technology vision and strategy, ensuring our interconnect solutions support the evolving needs of standards like PCIe, CXL, Ethernet, InfiniBand, and the next-gen AI workloads.
• Lead the evaluation of high-speed electrical, optical, and hybrid interconnect solutions, balancing performance, power, latency, cost, and manufacturability.
• Collaborate with senior architects and internal R&D, product development, and business units to shape product development roadmaps based on real-world customer challenges and market trends.
• Work cross-functionally with engineering, product management, sales, and marketing teams to translate technical insights into compelling product offerings.
• Drive the execution of high-impact, innovative technical projects, ensuring seamless alignment between customer needs, business goals, and engineering capabilities.
• Guide TE’s go-to-market strategy for new interconnect solutions, ensuring that our technical differentiation is clearly communicated and leveraged in competitive landscapes.

Skills

Compute systems

Networking

AI/ML

Storage systems

High-speed interconnect design

Signal integrity

Education

Bachelor’s degree in Mechanical Engineering

Tools

Simulation tools

CAD

Signal integrity analysis tools

Job description

TE Connectivity is seeking a STAFF R&D/PRODUCT DVL ENGINEER to shape the system architecture for next-generation compute, AI, storage and networking. You will engage with customers, translate needs into roadmaps, and influence product direction across TE’s interconnect platform.

The role emphasizes collaboration with engineering, R&D and marketing, with a remote-friendly setup and frequent travel to customer sites and conferences.