Remote System Architect: High-Speed AI Interconnect

TE Connectivity Corporation

United States

On-site

USD 141,400 - 212,200

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Remote workplace

Competitive compensation

Job summary

TE Connectivity is seeking a System Architect for Data & Devices to define high‑level architecture requirements and align TE’s roadmap with next‑gen compute, AI, and networking ecosystems. You will bridge customer needs with TE’s technology strategy and drive standards participation.

Travel to conferences and customer sites is expected. The role emphasizes cross‑functional leadership, collaboration with R&D, product management, and external partners to deliver scalable, performance‑oriented

Qualifications

Bachelor’s degree in Electrical Engineering or equivalent.
Experience with high-speed interconnect technologies and system-level design.

Responsibilities

Define high-level system architecture requirements aligned with compute, AI, and networking ecosystems.
Bridge customer needs with TE’s technology roadmap and develop future-proof interconnect solutions.
Collaborate with internal teams to shape product roadmaps based on real-world challenges and market trends.
Lead participation in standards groups and contribute to thought leadership content.