Remote ECAD PCB Design Engineer: Xpedition VX, High‑Speed DSP & RF

Moseley Technical Services, Inc.

United States

Remote

USD 120,000 - 160,000

Full time

14 days+

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Benefits offered by this job

Medical and supplemental insurance
401(k) plan

Job summary

Moseley Technical Services, Inc. is seeking a Senior ECAD PCB Design Engineer to support defense and aerospace electronics by designing complex PCBs using Xpedition VX, high-speed routing, and RF/digital DSP.

The role requires experience with DDR4/DDR5, multi-layer boards up to 28 layers, fabrication and assembly documentation, and collaboration across IPTs. U.S. Citizenship is required.

Qualifications

  • Bachelor’s degree in Electrical Engineering or related field with 8+ years of experience; Master’s degree with 6+ years of experience.
  • Extensive experience designing complex PCBs using ECAD tools.
  • Experience with multi-layer boards up to 28 layers.
  • Experience with high-speed digital PCB design, RF, and DSP circuitry.
  • Knowledge of PCB layout, fabrication processes, and manufacturing requirements.

Responsibilities

  • Create, revise, and maintain complex PCB layouts, electrical drawings, and BOMs using ECAD software.
  • Design high-speed, high-density PCB layouts supporting DSP, RF, and mixed-signal systems.
  • Develop layouts meeting electrical, mechanical, manufacturability, and reliability requirements.
  • Perform component placement, signal routing, impedance control, and electronic packaging.

Skills

High-speed PCB design
Signal integrity
EMI mitigation
RF design
DSP circuitry
Cross-functional IPT collaboration

Education

Bachelor's degree in Electrical Engineering or related field
Master's degree in related field

Tools

Siemens Xpedition VX 2.13+

Job description

Moseley Technical Services, Inc. is seeking a Senior ECAD PCB Design Engineer to support defense and aerospace electronics by designing complex PCBs using Xpedition VX, high-speed routing, and RF/digital DSP.

The role requires experience with DDR4/DDR5, multi-layer boards up to 28 layers, fabrication and assembly documentation, and collaboration across IPTs. U.S. Citizenship is required.

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