A leading semiconductor company is looking for a Realtime Defect Analysis Engineer to join its Advanced Packaging Technology Development department in Boise, Idaho. This role involves analyzing process flows for defects, utilizing advanced inspection tools, and collaborating with global teams for continuous improvement. Candidates should have a Bachelor's degree in Electrical or Chemical Engineering and several years of relevant semiconductor industry experience. Excellent communication skills and problem-solving abilities are essential.
Qualifications
Bachelor’s Degree in relevant engineering field plus 4-6 years semiconductor experience.
At least 3 years of experience in RDA.
Basic data science and programming skills.
Excellent verbal/written English communication skills.
Responsibilities
Analyze experimental process flows for anomalies.
Utilize inspection tools for early problem detection.
Collaborate globally to develop improvement methods.
Participate in technical meetings for opportunity synthesis.
Skills
Analytical skills
Problem-solving
Data manipulation
Communication skills
Technical writing
Education
Bachelor’s Degree in Electrical Engineering
Master’s Degree in related field
Tools
SEM
X-ray equipment
Laser systems
Optical systems
Job description
A leading semiconductor company is looking for a Realtime Defect Analysis Engineer to join its Advanced Packaging Technology Development department in Boise, Idaho. This role involves analyzing process flows for defects, utilizing advanced inspection tools, and collaborating with global teams for continuous improvement. Candidates should have a Bachelor's degree in Electrical or Chemical Engineering and several years of relevant semiconductor industry experience. Excellent communication skills and problem-solving abilities are essential.