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Intel is seeking an APTM Quality Engineering Manager to lead end-to-end Manufacturing Quality across APTM, with responsibility across FSO, Bumping, Wafer Level Assembly, EMIB, and other processes in Arizona, Oregon, and New Mexico.
The role drives quality programs, culture, and governance, including QRBs and cross-site coordination with Foundry, Supplier Q&R, and Customer Facing teams. Strong leadership and deep semiconductor process knowledge are required.
The APTM (Assembly Packaging Testing Manufacturing) Quality Engineering Manager will report into the APTM Q&R Manager and is accountable for end-to-end Manufacturing Quality leadership across APTM. The role will have direct responsibility for Quality programs and culture across FSO, Bumping, Wafer Level Assembly, EMIB, Base Wafer, Die Prep, Hybrid bonding, Optical packaging, Silicon photonics and Assembly Test Development (ATD) processes, spanning Arizona, Oregon, and New Mexico. They will also have dotted line responsibility for Quality programs across ATM sites to ensure consistency of integrated Quality programs across APTM as a whole.