Lead Project Manager - Advanced Packaging (2.5D/3D)

What’s Upstate; Durham (NC); On-site; USD 120,000 - 160,000; Full time

Job summary

Wolfspeed is seeking a Project Manager to lead the development and implementation of advanced packaging initiatives across high-performance computing (HPC), AI data center, and AR/VR applications.

You will manage the full project lifecycle—from initiation through delivery—for SiC-based packaging and related processing solutions, coordinating cross‑functional and external partner teams to bring new products and process capabilities to market on schedule and within budget.

Qualifications

• Experience managing complex technical development projects in semiconductor packaging or related hardware domains.
• Familiarity with advanced packaging architectures (2.5D/3D) and interposers; experience with AR/VR processing like waveguide fabrication is a plus.
• Experience coordinating with external partners such as foundries, OSATs, research institutes on joint development or product delivery.

Responsibilities

• Lead development and implementation of advanced packaging products and processing solutions across 2.5D/3D architectures; coordinate initiatives from initiation through delivery.
• Organize and lead cross-functional teams across design, processing, applications engineering, and product management to deliver packaging products and upgrades.
• Plan, direct, and monitor project schedules, milestones, dependencies, and deliverables to ensure on-time completion; identify and mitigate risks.
• Monitor budget and resource allocation; drive projects to completion within defined budget constraints.
• Coordinate design and processing workstreams to translate requirements into executable project plans across development and qualification phases.
• Manage interfaces with external partners—foundries, OSATs, research institutes—ensuring smooth collaboration and aligned timelines.
• Provide regular status reporting to internal leadership and external partners, escalating issues as needed.

Skills

Project management

Cross-functional coordination

Stakeholder communication

Budget management

Risk management

Schedule management

Education

Bachelor's degree in Electrical Engineering, Materials Science, or related technical field

Job description

Wolfspeed is seeking a Project Manager to lead the development and implementation of advanced packaging initiatives across high-performance computing (HPC), AI data center, and AR/VR applications.

You will manage the full project lifecycle—from initiation through delivery—for SiC-based packaging and related processing solutions, coordinating cross‑functional and external partner teams to bring new products and process capabilities to market on schedule and within budget.